Fluid transmission device

Abstract

The invention discloses a fluid transmission device, which comprises a bearing plate, electronic control valves, and a supporting plate, wherein a plurality of through holes are arranged in the bearing plate, the through holes comprise first round through holes and second square through holes, and the first round through holes and the second square through holes are communicated; the electronic control valves comprise first valve parts and second valve parts, the shape of each first valve part is corresponding to that of each first round through hole of the bearing plate, and the shape of each second valve part is corresponding to that of each second square through hole of the bearing plate; the supporting plate is fixed on the second valve parts of the electronic control valves, the first valve parts of the electronic control valves extend out of the first round through holes, and the second valve parts and the supporting plate are clamped in the second square through holes. Compared with the prior art, as the supporting plate is arranged below the second valve parts of the electronic control valves, the electronic control valves can be firmly clamped in the bearing plate, and disassembly is easy.

Description

【Technical field】 [0001] The invention relates to the field of semiconductors, in particular to a fluid delivery device. 【Background technique】 [0002] At present, integrated circuits are gradually being applied to many fields, such as computers, communications, industrial control and consumer electronics. The manufacturing of integrated circuits has become a basic industry as important as steel. [0003] Wafers are the carriers used to produce integrated circuits. In actual production, the wafers that need to be prepared have a flat, ultra-clean surface, and the existing methods for preparing ultra-clean wafer surfaces can be divided into two categories: wet processes such as immersion and spray techniques, and processes such as Dry treatment process based on chemical vapor and plasma technology. Among them, the wet processing process is a relatively widely used method in the prior art. The wet processing process usually includes a series of steps of immersing or sprayi...

AI Technical Summary

Problems solved by technology

[0004] However, the existing equipment for preparing ultra-clean wafer surfaces generally has the following disadvantages: 1. The structure is very complicated, the volume is relatively large, and the cost is also high; 2. Once these equipment fails, troubleshooting generally requires stopping the production line Production affects output; 3. Once the installation is completed, it is not easy to adjust and change the function and position; 4. It is inconvenient to carry

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