Semi-automatic alignment machine

Abstract

The invention discloses a semi-automatic alignment machine, comprising: a frame, a workpiece table, a wedge-shaped error compensation mechanism, a film loading mechanism, a covering mechanism, a bonding fixture positioning mechanism, an MVS optical mechanism, and a bonding fixture automatic turning mechanism; wherein, the The workpiece table is installed on the frame, and is used to carry the wedge-shaped error compensation mechanism and the loading mechanism to perform three-degree-of-freedom movements of X, Y, and Rz; the covering part is fixed on the frame, and is located above the loading mechanism, and the bonding The fixture positioning mechanism is installed on the cover mechanism to realize the positioning and clamping of the bonding fixture; the MVS optical mechanism is installed on the frame, and three sets of single-axis drivers realize X, Y, and Z three-degree-of-freedom movements; the key An automatic overturning mechanism for the bonding fixture is installed on the frame for automatic overturning of the bonding fixture. The semi-automatic alignment machine of the present invention can improve the stability of equipment, reduce human operation errors, improve precision, reduce labor intensity, and increase productivity.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a semi-automatic alignment machine. Background technique [0002] In the semiconductor process, the alignment machine is an auxiliary equipment for substrate bonding, which is used to align two substrates before substrate bonding. [0003] Common alignment equipment includes: substrate wedge error compensation system, motion stage system and machine vision system. Among them, the substrate wedge error compensation system makes the two substrates to be aligned parallel; the moving table system carries the substrate to move in the X, Y, and Rz directions, so that the second substrate mark is aligned with the first substrate mark; machine vision The system shoots substrate marks through a microscope objective lens, converts the optical path through a beam splitter, a mirror, etc., and the lens barrel lens is imaged to a CCD camera, and finally displayed on the interf...

AI Technical Summary

Problems solved by technology

[0004] In the existing alignment equipment, the following two methods are usually used to position the bonding fixture. One is to push two shafts with cylinders on both sides of the bonding fixture respectively, and contact the positioning fixture with the arc surfaces on both sides of the bonding fixture The mechanism is affected by factors such as the installation accuracy of the cylinder, the fit clearance between the cylinder shaft and the sleeve, and the position accuracy of the arc surfaces on both sides of the bonding fixture, which makes it difficult to improve the positioning accuracy of the bonding fixture; the other is to use three cones The pins are matched with the corresponding taper holes of the bonding fixture. Although this structure can improve the positioning accuracy, the positioning accuracy is the combination of three sets of taper pins / taper holes. The processing cost is high, and the positioning operation is time-consuming

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