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A kind of deposition accelerator and application for mechanical copper plating and copper alloy coating

A technology for depositing accelerators and copper alloy layers, which is applied in the coating process and coating of metal materials. It can solve the problems of easy oxidation of metal copper and many standard electrode potentials, and achieve the effect of fast powder application and uniform color.

Active Publication Date: 2017-12-01
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main layered material used in mechanical copper plating and copper alloy is copper powder or copper alloy powder. Compared with zinc and zinc alloy powder, metal copper is easy to oxidize, and the standard electrode potential of metal copper is more positive than zinc, so From the perspective of mechanism analysis, conventional mechanical galvanizing deposition accelerators (or accelerators added during the process of mechanical galvanizing coating thickening) are no longer suitable for mechanical copper plating and copper alloy coating processes

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The composition and weight percent of the deposition accelerator of mechanical copper plating and copper alloy layer described in the present embodiment are:

[0018] Diatomaceous earth 0.5%

[0019] Sodium Gluconate 1%

[0020] Triethanolamine 0.5%

[0021] Stannous Chloride 40%

[0022] Ammonium dihydrogen phosphate 1%

[0023] OP-10 6%

[0024] Sulfuric acid 1%

[0025] water 50%

[0026] The above raw materials are all industrial grade chemical raw materials, and the water is clean tap water.

[0027] The deposition accelerator for mechanical copper plating and copper alloy coating described in this embodiment is used for mechanical copper and copper alloy plating on the surface of iron and steel parts. The iron and steel parts to be plated are 100 kg of flat gaskets with a thickness of Ф20 and a thickness of 3 mm, and the surface area to be plated is 9.5 ㎡. Prepare the aqueous deposition accelerator solution according to the above raw materials and their we...

Embodiment 2

[0029] The composition and weight percent of the deposition accelerator of mechanical copper plating and copper alloy layer described in the present embodiment are:

[0030] Diatomaceous earth 1%

[0031] Sodium Gluconate 2%

[0032] Triethanolamine 1%

[0033] Stannous Sulfate 45%

[0034] Ammonium dihydrogen phosphate 3%

[0035] OP-10 8%

[0036] Phosphoric acid 1%

[0037] water 39%

[0038] The above raw materials are all industrial grade chemical raw materials, and the water is clean tap water.

[0039] The deposition accelerator for mechanical copper plating and copper alloy coating described in this embodiment is used for mechanical copper plating and copper alloy on the surface of iron and steel parts. The iron and steel parts to be plated are 100 kg of flat gaskets with a thickness of Ф16 and 2 mm, and the surface area to be plated is 14 ㎡. Prepare the aqueous deposition accelerator solution according to the above raw materials and their weight percentages (f...

Embodiment 3

[0041] The composition and weight percent of the deposition accelerator of mechanical copper plating and copper alloy layer described in the present embodiment are:

[0042] Diatomaceous earth 0.6%

[0043] Sodium Gluconate 1.4%

[0044] Triethanolamine 0.8%

[0045] Stannous Sulfate 35%

[0046] Ammonium dihydrogen phosphate 2.4%

[0047] OP-10 5%

[0048] Sulfuric acid 1.5%

[0049] Water 53.3%

[0050] The above raw materials are all industrial grade chemical raw materials, and the water is clean tap water.

[0051] The deposition accelerator for mechanical copper plating and copper alloy coating described in this embodiment is used for mechanical copper plating and copper alloy on the surface of iron and steel parts. The surface area is 22.5㎡. Prepare the aqueous deposition accelerator solution according to the above raw materials and their weight percentages (add sulfuric acid to the water first, then add OP-10, and finally add other chemical raw materials). The ...

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Abstract

The invention discloses a sedimentation accelerating agent and application used for a coating mechanically plated with copper and copper alloy and belongs to the technical field of surface plating. The sedimentation accelerating agent is prepared from 0.5%-1% of diatomite, 1%-2% of sodium gluconate, 0.5%-1% of triethanolamine, 35%-45% of stannous salt, 1%-3% of ammonium dihydrogen phosphate, 5%-10% of OP-10, 1%-1.5% of inorganic acid and the balance water according to a certain adding sequence. The sedimentation accelerating agent is applied to mechanical plating method through which a copper coating or a copper alloy coating is formed on the surface of a steel product, and the adding amount of the sedimentation accelerating agent is 1 / 3-1 / 2 the adding mass of copper powder or copper alloy powder. By adopting the sedimentation accelerating agent in the mechanical plating technique of the steel product, the copper powder or the copper alloy powder can subside on the surface of the steel product rapidly, and the copper coating and the copper alloy coating which are smooth in surface and uniform in color can be obtained.

Description

technical field [0001] The invention relates to a deposition accelerator for mechanical copper plating and copper alloy plating and its application, belonging to the technical field of surface plating. Background technique [0002] Mechanical plating technology is a new type of green surface protection technology that entered industrial application in developed countries such as Europe and the United States in the 1960s. It has the characteristics of high efficiency, low cost, low energy consumption, simple process, and low environmental pollution. In recent years, with the increasing pressure of environmental protection and the closure of small electroplating factories, mechanical plating technology has been favored by the surface treatment industry. However, some problems have also been exposed in the development process, such as the single type of coating, especially it is difficult to meet the production needs of related industries. With the development of green surface...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C24/00
CPCC23C24/00
Inventor 王胜民李继锋赵晓军谭蓉王玉光申国成
Owner KUNMING UNIV OF SCI & TECH
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