Device for two-stage ejection and forcible stripping of snap joint
A secondary ejection and card release technology, applied in the field of molds, can solve problems such as excessive cost consumption, increased mechanism complexity, and inconvenient maintenance, achieving reliable performance, simple structure, and easy maintenance.
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[0013] Such as figure 1 As shown, a device for secondary ejection and strong release buckle, including mold core A plate 1, mold core B plate 2, bottom plate 3, spring pin 4, plastic part ejector pin 5, the mold core B plate The upper part of 2 is connected with the mold core A plate 1, and the lower part is set on the bottom plate 3; the ejector pin 5 of the plastic part passes through the bottom plate 3 and is connected with a thimble plate 6, and the thimble plate 6 is located on the bottom plate 3 and is set on the mold core Inside the B plate 2, a return needle spring 7 is arranged between the thimble plate 6 and the mold core A plate 1; one end of the spring pin 4 passes through the mold core A plate 1 and is connected with the buckle 8, and the other end of the spring pin 4 One end passes through the thimble plate 6 and is connected to the bottom plate 3; the end of the spring pin 4 close to the mold core A plate 1 is provided with a thimble 41, and the top of the thimb...
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