Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A memory testing device and a memory chip testing method

A technology for memory testing and memory chips, applied in static memory, instruments, etc., can solve the problems of ineffective recording of information, expensive AFM, low utilization of AFM hardware storage space, etc., and achieve the effect of improving utilization and test speed

Active Publication Date: 2018-10-16
SHANGHAI HUALI MICROELECTRONICS CORP
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. Due to the one-to-one correspondence between AFM and DUT addresses, this requires the same capacity of AFM and DUT, which makes AFM very expensive
[0004] 2. In general, the failure address of a DUT is much smaller than its capacity, and the traditional failure address storage method, even if only one bit (Bit) of the tested DUT fails, AFM must specially set aside a space equal to the capacity of the DUT To correspond with the DUT one by one, and carry out the identification operation of all addresses of the DUT, so that the information is not effectively recorded in the AFM, and the utilization rate of the AFM hardware storage space is very low
thus greatly affecting the test speed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A memory testing device and a memory chip testing method
  • A memory testing device and a memory chip testing method
  • A memory testing device and a memory chip testing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] In order to make the purpose and features of the present invention more comprehensible, the specific embodiments of the present invention will be further described below with reference to the accompanying drawings. However, the present invention can be implemented in different forms and should not be limited to the described embodiments.

[0036] With the continuous advancement of semiconductor technology, those large memories that originally existed in wafers will be transformed into tens or hundreds of small memory arrays, and they will be scattered in every corner of the wafer. The technical scheme of the present invention is mainly aimed at improving the problems of low efficiency of collecting invalid address information and poor utilization of AFM hardware during the large-scale simultaneous testing of such large-scale memories (flash memory, SRAM, DRAM, etc.). Please refer to Figure 4 As shown, because there are often multiple memory chip units (Die) that need to be...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a memorizer testing device and a memorizer chip testing method. The relation that address spaces of invalid address memorizers of traditional memorizer testing instruments correspond to address spaces of tested chips one to one is changed. The address spaces of the invalid address memorizers are segmented into continuous stored record units. Each stored record unit does not store address data of bits passing tests any more and only stores address data of bits failing to pass the tests, including home addresses of quad-side contact where the stored invalid bits are located, relative addresses in the quad-site contact where the invalid bits are located in chips, address information in the chips where the invalid bits are located and the like. In this way, in the memorizer function testing process, invalid information of multiple chips are stored at the same time, and the utilization rate and the testing speed of invalid address hardware storage spaces are greatly increased.

Description

Technical field [0001] The invention relates to the technical field of semiconductor testing, in particular to a memory testing device and a memory chip testing method. Background technique [0002] The birth of chips (or integrated circuits, ICs) has prompted human society to enter a colorful era of digitization, informationization, and intelligence. Computers, mobile phones, digital cameras, high-definition digital TVs, automobile electronic controls, navigation systems, medical equipment, ordnance equipment..., chips are everywhere. In the process of rapid development of chips toward high integration (LSI, VLSI), high speed, and high performance, humans' pursuit of perfect chips has become more and more intense. However, in the real world, in the design, processing, manufacturing and production of integrated circuits, various human and non-human factors lead to errors that are unavoidable. These errors cause waste of resources and dangerous accidents. Personal injury and deat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G11C29/56
Inventor 李强席与凌王继华高金德
Owner SHANGHAI HUALI MICROELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products