Ram-type splitting system

Abstract

The invention provides a ram-type splitting system, which comprises an impact plate, a groove plate and a control module, wherein at least one impact head for impacting to-be-divided wafers is arranged on the impact plate; the impact heads are evenly distributed on the impact plate; at least one groove matched with the impact heads is formed in the groove plate; the grooves are evenly distributed in the groove plate; the number of the impact heads and the number of the grooves are the same as that of crystal particles on the to-be-divided wafers; and the control module is used for controlling the impact heads on the impact plate to impact the to-be-divided wafers on the groove plate and controlling the impact heads to impact the to-be-divided wafers into the grooves in the groove plate. According to the ram-type splitting system provided by the invention, the splitting production efficiency can be improved, so that the split product yield is improved.

Description

technical field [0001] The invention relates to the field of light-emitting diode manufacturing, in particular to a stamping split system. Background technique [0002] In the production process of light-emitting diode (Light Emitting Diode, referred to as LED) chips, the splitting process is a key step related to the final yield of the finished product. The connected dies are separated into individual entities, and the connected dies are separated from each other to form core dies. [0003] At present, in the process of dividing the COW wafer into independent individual grains, the splitting device in the splitter is mainly used to exert a certain impact force on the COW wafer between the grain and the cutting line of the grain, and the COW The wafer is cleaved into individual dies. However, the splitting tool of the splitting device in the current splitting machine mainly uses a cuboid shape, which can only split one row of grains in the X direction or Y direction at a t...

AI Technical Summary

Problems solved by technology

However, the splitting tool of the splitting device in the current splitting machine mainly uses a cuboid, which can only split one row of grains in the X direction or Y direction at a time, which consumes a long time and the machine capacity is low.

[0004] Therefore, in the process of dividing the COW wafer into independent individual grains by using the current splitter, since the splitting tool of the splitter in the splitter can only split a row of grains in the X direction or the Y direction at a time, time consumption Longer, reducing the efficiency of die splitting from COW wafers

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