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Solderable conductive polymer thick film composition

A technology of conductive polymer, thick film composition, applied in welding equipment, conductive paint, welding medium, etc., can solve problems such as difficult welding

Inactive Publication Date: 2015-12-23
HERAEUS PRECIOUS METALS NORTH AMERICA CONSHOHOCKEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] One problem with conductive PTF compositions is that they are difficult to solder

Method used

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  • Solderable conductive polymer thick film composition
  • Solderable conductive polymer thick film composition

Examples

Experimental program
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Effect test

Embodiment 1

[0056] Ten solderable PTF compositions were prepared using the materials listed in Table 1 below. The phenolic resin in each of the compositions was Varcum 29112, commercially available from Durez Corporation of Addison, Texas, and the solvent was butyl carbitol acetate, commercially available. All amounts are provided in weight percent of the total PTF composition. Each PTF composition contains 50 and specific surface area (SSA) of silver powder or silver flake.

[0057] Table 1. Exemplary PTF Compositions P1-P10

[0058]

[0059] Each PTF composition was then coated onto an FR4 substrate (glass reinforced epoxy laminate) using the doctor blade method. Two mil tape was applied to both sides of the substrate, leaving about 0.75 inches of unobstructed surface area of ​​the FR4 substrate. A small amount of the PTF composition was added between the tapes and a blade was used to smooth out the PTF composition between the tape pieces. The tape was then removed leaving a smo...

Embodiment 2

[0063] Conductive PTF compositions were prepared using the starting materials listed in Table 3 below. The components used were as follows: phenolic resin and solvent #1 were the same as used in Example 1; polyimide resin was 14% polyimide resin, 26% gamma butyrolactone commercially available from Alfa Aesar of Ward Hill, MA and 60% sulfolane; the epoxy resin is commercially available from EpoxyTechnology, Inc. of Billerica, Massachusetts. H61-110 unfilled epoxy; solvent #2 is gamma butyrolactone; hardener is boron fluoride monoethylamine; thinner is Erisys commercially available from Emerald Performance Materials of Moorestown, NJ TM GE-21; and thixotrope is commercially available from BYK Additives, Inc. of Austin, Texas. . Controls were formulated with silver flake and polyimide / epoxy resin, while all exemplary compositions were formulated with silver powder and a combination of silver flake and phenolic resin. All amounts are provided in weight percent of the total PT...

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Abstract

A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.

Description

technical field [0001] This invention relates to solderable conductive polymer thick film compositions. The composition is particularly suitable for low temperature applications and is compatible with lead-free soldering techniques. Background technique [0002] Conductive polymer thick film (PTF) compositions are becoming increasingly advantageous for use in various electronic components in many applications including, but not limited to, low temperature hybrid systems, LED applications, automotive applications, power electronics, low temperature Heater applications, antenna or RF applications, and fuel cells. Generally, these PTF compositions are used to form conductive layers on various substrates. Because conductive PTF compositions typically do not have a glass component (as conventional thick film materials used in similar applications do), they do not require the high ignition temperatures (eg, greater than 500° C.) of conventional thick film materials. Many conduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D5/24C09D11/52H01B1/22
CPCB23K35/0244B23K35/025B23K35/3006B23K35/3013B23K35/302B23K35/3033B23K35/322B23K35/3613B23K35/362B23K35/365Y10T428/31678C08J5/18C08K3/08C08L61/06C08L2203/20H05K3/34H05K3/3457H05K3/3478H05K3/3489H05K2203/041H05K2203/0485H05K2203/12
Inventor S·沙赫巴茨S·格拉贝
Owner HERAEUS PRECIOUS METALS NORTH AMERICA CONSHOHOCKEN
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