Piezoelectric-triboelectric composite mems broadband energy harvester and preparation method thereof
An energy harvester and piezoelectric energy technology, applied in the field of micro-energy, can solve the problems of low output power and narrow frequency band, and achieve the effect of improving output performance, improving output performance and wide application prospect.
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[0063] The present invention also provides a method for preparing a piezoelectric-triboelectric composite MEMS broadband energy harvester, comprising the following steps:
[0064] S1: Using bonding and thinning techniques to prepare a piezoelectric thick film layer on a silicon wafer, and fabricate a piezoelectric thick film electrode layer (5) on the surface of the piezoelectric thick film (3);
[0065] The silicon wafer refers to an SOI silicon wafer whose upper and lower surfaces are polished on both sides and a layer of silicon dioxide is thermally oxidized on the surface.
[0066] The step of preparing a piezoelectric thick film layer by bonding and thinning technology, specifically includes: combining the single-sided polished piezoelectric body with the silicon wafer through epoxy bonding technology, or combining the polished surface of the piezoelectric body with the silicon wafer After a layer of electrode layer is deposited on the surface, the piezoelectric material ...
Embodiment 1
[0082] Such as figure 1 As shown, the piezoelectric-triboelectric composite MEMS energy harvester in this embodiment includes the main structure of the piezoelectric energy harvester, a blocking block and a gasket;
[0083] The main structure of the piezoelectric energy harvester includes: a silicon fixed base, 2 silicon-based piezoelectric cantilever beams and 2 mass blocks;
[0084] The silicon fixed base includes: a silicon wafer (1) and silicon dioxide layers (2) on both sides thereof;
[0085] The silicon-based piezoelectric cantilever beam on the piezoelectric main structure includes: a silicon cantilever beam support layer and a piezoelectric thick film layer attached to the silicon cantilever beam support layer; the silicon cantilever beam support layer includes a second silicon layer (4), a The silicon dioxide layer (2) on the upper and lower surfaces of the second silicon layer (4) and the supporting layer electrode layer (16) on the silicon dioxide layer (2) on the...
Embodiment 2
[0114] Such as image 3 As shown, a piezoelectric-triboelectric composite MEMS energy harvester provided in this embodiment includes: a main structure of the piezoelectric energy harvester, a blocking block and a gasket.
[0115] The main structure of the piezoelectric energy harvester includes: a silicon fixed base, 2 silicon-based piezoelectric cantilever beams and 2 mass blocks;
[0116] The silicon fixing base comprises: a silicon wafer (1) and silicon dioxide layers (2) on both sides thereof;
[0117] The silicon-based piezoelectric cantilever beam on the piezoelectric main structure includes: a silicon cantilever beam support layer and a piezoelectric thick film layer attached to the silicon cantilever beam support layer; the silicon cantilever beam support layer includes a second silicon layer (4), a The silicon dioxide layer (2) on the upper and lower surfaces of the second silicon layer (4) and the supporting layer electrode layer (16) on the silicon dioxide layer (2...
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