Circuit board device assembly with shock absorption function
A circuit board, dust-proof technology, applied in the field of dust-proof circuit board device components, can solve the problems of difficult maintenance and installation by users, affecting the targeted heat dissipation of heat dissipation chips, and increasing installation costs.
Inactive Publication Date: 2015-12-30
林炳彩
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Problems solved by technology
But this heat dissipation mode is easy to cause problems of installation and cost increase, and it also brings difficulties to later maintenance
[0003] At present, some cooling devices that can concentrate heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles for users that are difficult to maintain and difficult to install.
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[0009] Combine below Figure 1-2 The present invention will be described in detail.
[0010] According to an embodiment, a shock-absorbable dust-proof circuit board device assembly includes a circuit board device 12, a hinged frame 9 fixed at one end of the circuit board device 12, and a cooling plate connected to the hinged frame 9 Device 2, wherein, the main body block 91 of the hinged frame 9 is provided with a vertical guide rail groove 10 and a horizontal guide rail groove 7 for clamping with one end of the vertically slidable clamping positioning block 11 and the horizontally slidable clamping positioning block 11 respectively. One end of the positioning block 5 is slidingly fitted, and the main body block 91 of the hinged frame 9 is also connected with one end of the vertical guide rod 3 wound with the vertical tension spring 4 and the horizontal guide rod 14 wound with the horizontal tension spring 13 One end is fixedly connected, the other end of the vertical guide r...
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The invention discloses a circuit board device assembly with a shock absorption function. The circuit board device assembly comprises a circuit board device (12), a hinge frame (9) fixedly arranged at one end of the circuit board device (12), and a cooling board device (2) connected with the hinge frame (9), wherein a vertical guide rail groove (10) and a horizontal guide rail groove (7) are formed in a main body block (91) of the hinge frame (9), and used for being in sliding fit with one end of a vertically slidable clamp positioning block (11) and one end of a horizontally slidable clamp positioning block (5) respectively; the main body block (91) of the hinge frame (9) is fixedly connected with one end of a vertical guide rod (3) and one end of a horizontal guide rod (14) respectively; a vertical extension spring (4) and a horizontal extension spring (13) wind around the end of the vertical guide rod (3) and the end of the horizontal guide rod (14) respectively.
Description
technical field [0001] The invention relates to the field of circuit boards, in particular to a shock-absorbing dust-proof circuit board assembly. Background technique [0002] In the field of circuit boards, it is often necessary to conduct targeted heat dissipation for heat dissipating components in the circuit board, such as high-power chips. Now it is often used to install a separate cooling fan on these chips to achieve effective heat dissipation. However, this heat dissipation mode is easy to cause problems of installation and cost increase, and also brings difficulties to later maintenance. [0003] At present, some cooling devices capable of centralized heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles that are difficult to maintain and difficult to install for users. If the positioning is not accurate during the installation process, it will affect the targeted heat dissipation of the cooling chip, thereby af...
Claims
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Inventor 林炳彩
Owner 林炳彩