scoring device

Abstract

The present invention relates to a scribing device that does not interfere with the grippers even if the width of the end material region of the substrate is as small as the edge grip of the grippers, and can perform scribing along a planned scribing line. The loader (A) that transfers the substrate (W) from the first position to the second position on the downstream side of the substrate transfer direction, and the upstream end of the substrate (W) transferred to the second position, is controlled by the gripper (11 ) in a gripped state, the scribing apparatus includes a gripping and transporting unit (B) that transports to the scribing unit (C) disposed on the downstream side, and the substrate (W) that is transported to the scribing unit (C) The surface of the surface is marked by the cutter wheel (23) of the marking unit (C) to mark the planned marking line (S2) in the Y direction. The loader (A) can move in the X direction simultaneously with the suction transport member (2).

Description

technical field [0001] The present invention relates to a scribing device for a brittle material substrate, which processes a scribing line (groove) for breaking along a scribing predetermined line on the surface of a brittle material such as glass, silicon, and ceramics. In particular, the present invention relates to a scribing device for a brittle material substrate in which terminal material regions are formed at four-sided peripheral portions. Background technique [0002] In general, when cutting a unit substrate from a brittle material substrate (hereinafter, simply referred to as "substrate"), as Figure 10 As shown, first, the scribing line is processed along the X-direction scribing line S1 and the Y-direction scribing line S2 that are perpendicular to each other on the surface of the substrate W', and the next step is to process the scribing line along the above A plurality of scribe lines S1 and S2 are used to scribe and cut a unit substrate to be a product. In ...

AI Technical Summary

Problems solved by technology

However, if the width of the terminal material region T is reduced to 3mm, as shown in FIG. Line S1

[0009] Also, the same applies to the case of marking the planned marking line S2 in the Y direction, such as Figure 8 If the position of the jaws 11 shown is placed on the planned marking line S2 in the Y direction that must be processed, the cutter wheel 23 will be interfered by the jaws 11 so that the planned marking line S2 in the Y direction cannot be completely scored. at last

[0010] This shows that the above-mentioned existing marking device obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. Urgent problem

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