Laser cooling device
A technology of laser cooling and cooling cavity, which is applied in the field of laser, can solve the problems of a large amount of power generation, the lack of heat dissipation structure of the laser module, and the influence of the service life of the laser module, etc.
Active Publication Date: 2019-07-19
HUIZHOU JIEPUTE ELECTRONICS TECH
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Problems solved by technology
[0003] Based on this, it is necessary to provide a laser cooling device for the existing laser module that lacks a good heat dissipation structure, resulting in a large amount of heat during work, which affects the service life of the laser module, and effectively absorbs the laser module during work. A large amount of heat generated in the laser, and dissipate the heat, greatly improving the service life of the laser module
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[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0027] It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or there may also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ...
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The invention relates to a laser cooling device comprising multiple laser modules, a thermal insulation board, and a cooling mechanism. Multiple isolating members are arranged on the thermal insulation board at intervals. The laser modules are arranged between every two adjacent isolating members, respectively. The cooling mechanism is connected with the thermal insulation board and comprises multiple cooling boards connected with the thermal insulation board. The multiple cooling boards are connected and a cooling chamber is defined by the multiple cooling boards. The thermal insulation board separates the multiple laser modules so that the heat among the multiple laser modules cannot concentrate. Further, after the thermal insulation board absorbs the heat, the heat is dissipated by the cooling mechanism. Thus, the heat of the laser modules can be effectively dissipated and the service lives of the laser modules are greatly prolonged.
Description
technical field [0001] The invention relates to the field of laser technology, in particular to a laser cooling device. Background technique [0002] With the continuous development of laser technology, more and more mature laser technology is applied in various technical fields, such as laser marking, laser printing, laser cutting and laser ranging, etc. Laser has strong directionality, high brightness and concentrated energy. Therefore, the laser light source often generates a lot of heat during work. If the heat is not dissipated in time, it will affect the working efficiency of the laser light source and related working components, and may even lead to the breakdown of the laser light source and related working components. burn. Contents of the invention [0003] Based on this, it is necessary to provide a laser cooling device for the existing laser module that lacks a good heat dissipation structure, resulting in a large amount of heat during work, which affects the ...
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IPC IPC(8): H01S3/04
Inventor 刘健黄治家成学平
Owner HUIZHOU JIEPUTE ELECTRONICS TECH