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Adjustable circuit board device assembly with cooler

A circuit board and cooling plate technology, applied in the field of adjustable circuit board device components, can solve problems such as difficult maintenance and installation by users, difficult positioning, installation, opening and maintenance of heat sinks, and affecting the stability and reliability of the overall system operation of the circuit board.

Inactive Publication Date: 2016-01-06
林炳彩
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this heat dissipation mode is easy to cause problems of installation and cost increase, and it also brings difficulties to later maintenance
[0003] At present, some cooling devices that can concentrate heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles for users that are difficult to maintain and difficult to install.
If the positioning is inaccurate during the installation process, it will affect the targeted heat dissipation of the cooling chip, thereby affecting the operation stability and reliability of the overall system of the circuit board

Method used

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  • Adjustable circuit board device assembly with cooler
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Embodiment Construction

[0009] Combine below Figure 1-2 The present invention will be described in detail.

[0010] An adjustable circuit board device assembly with a cooler according to an embodiment, comprising a circuit board device 12, a hinged frame 9 fixedly arranged at one end of the circuit board device 12, and a cooling plate device connected to the hinged frame 9 2. Wherein, the main body block 91 of the hinged frame 9 is provided with a vertical guide rail groove 10 and a horizontal guide rail groove 7 for positioning with one end of the vertically slidable clamping positioning block 11 and the horizontally slidable clamping positioning block 11 respectively. One end of the block 5 is slidingly fitted, and the main body block 91 of the hinged frame 9 is also connected with one end of the vertical guide rod 3 wound with the vertical tension spring 4 and the horizontal guide rod 14 wound with the horizontal tension spring 13. One end is fixedly connected, and the other end of the vertical ...

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PUM

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Abstract

An adjustable circuit board device assembly with a cooler comprises a circuit board device (12), a hinging frame (9) fixed on one end of the circuit board device (12), and a cooling plate device (2) connected with the hinging frame (9), wherein a main body block (91) of the hinging frame (9) is provided with a vertical guide rail groove (10) and a horizontal guide rail groove (7) which are respectively used for being matched with one end of a vertically-slidable clamping positioning block (11) and one end of a horizontally-slidable clamping positioning block (5) in a sliding manner; and the main body block (91) of the hinging frame (9) is further fixedly connected with one end of a vertical guide rod (3) wound by a vertical extension spring (4) and one end of a horizontal guide rod (14) wound by a horizontal extension spring (13).

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to an adjustable circuit board assembly with a cooler. Background technique [0002] In the field of circuit boards, it is often necessary to conduct targeted heat dissipation for heat dissipating components in the circuit board, such as high-power chips. Now it is often used to install a separate cooling fan on these chips to achieve effective heat dissipation. However, this heat dissipation mode is easy to cause problems of installation and cost increase, and also brings difficulties to later maintenance. [0003] At present, some cooling devices capable of centralized heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles that are difficult to maintain and difficult to install for users. If the positioning is not accurate during the installation process, it will affect the targeted heat dissipation of the cooling chip, thereby aff...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K1/18
Inventor 林炳彩
Owner 林炳彩