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Circuit board device assembly capable of reducing shock

A technology for circuit boards and components, applied in the direction of printed circuit components, cooling/ventilation/heating transformation, etc., can solve the problems of targeted heat dissipation affecting the heat dissipation chip, difficulty in post-maintenance, and difficulty in maintenance and installation for users

Inactive Publication Date: 2016-01-06
肖白玉
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this heat dissipation mode is easy to cause problems of installation and cost increase, and it also brings difficulties to later maintenance
[0003] At present, some cooling devices that can concentrate heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles for users that are difficult to maintain and difficult to install.
If the positioning is inaccurate during the installation process, it will affect the targeted heat dissipation of the cooling chip, thereby affecting the operation stability and reliability of the overall system of the circuit board

Method used

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  • Circuit board device assembly capable of reducing shock
  • Circuit board device assembly capable of reducing shock

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Embodiment Construction

[0009] Combine below Figure 1-2 The present invention will be described in detail.

[0010] A shock-absorbable circuit board device assembly according to an embodiment includes a circuit board device 12, a hinged frame 9 fixedly arranged at one end of the circuit board device 12, and a cooling plate device 2 connected to the hinged frame 9, Wherein, the main body block 91 of the hinged frame 9 is provided with a vertical guide rail groove 10 and a horizontal guide rail groove 7 for connecting with one end of the vertically slidable clamping positioning block 11 and the horizontally slidable clamping positioning block 5 respectively. One end of the hinge frame 9 is also fixed with one end of the vertical guide rod 3 wound with the vertical tension spring 4 and one end of the horizontal guide rod 14 wound with the horizontal tension spring 13. connected, the other end of the vertical guide rod 3 and the other end of the horizontal guide rod 14 are respectively fixedly connecte...

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Abstract

A circuit board device assembly capable of reducing shock includes a circuit board device (12), an articulated frame (9) fixed to an end of the circuit board device (12), and a cooling plate device (2) connected to the articulated frame (9); wherein a main body block (91) of the articulated frame (9) is provided with a vertical guide-track groove (10) and a horizontal guide-track groove (7) which are in a slip fit relationship with an end of a vertical slidable clamping locating block (11) and an end of a horizontal slidable clamping locating block (5) respectively; the main body block (91) of the articulated frame (9) is fixedly connected to an end of a vertical guide rod which is wound with a vertical tensile spring (4), and an end of a horizontal guide rod which is wound with a horizontal tensile spring (14).

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a shock-absorbable circuit board assembly. Background technique [0002] In the field of circuit boards, it is often necessary to conduct targeted heat dissipation for heat dissipating components in the circuit board, such as high-power chips. Now it is often used to install a separate cooling fan on these chips to achieve effective heat dissipation. However, this heat dissipation mode is easy to cause problems of installation and cost increase, and also brings difficulties to later maintenance. [0003] At present, some cooling devices capable of centralized heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles that are difficult to maintain and difficult to install for users. If the positioning is not accurate during the installation process, it will affect the targeted heat dissipation of the cooling chip, thereby affecting th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K1/02
Inventor 肖白玉
Owner 肖白玉