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Peeling apparatus and peeling method for laminate and manufacturing method of electronic device

A technology of peeling device and laminated body, which is applied in the fields of printed circuit manufacturing, electrical components, photovoltaic power generation, etc., can solve problems such as deterioration of substrate handleability, and achieve the effects of shortening non-operation time, easy exchange and easy replacement.

Active Publication Date: 2016-01-27
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, if the thickness of the substrate becomes thinner, the handleability of the substrate deteriorates, so it is difficult to form functional layers for electronic devices (thin film transistor (TFT: ThinFilmTransistor) and color filter (CF: ColorFilter)) on the surface of the substrate

Method used

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  • Peeling apparatus and peeling method for laminate and manufacturing method of electronic device
  • Peeling apparatus and peeling method for laminate and manufacturing method of electronic device
  • Peeling apparatus and peeling method for laminate and manufacturing method of electronic device

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Embodiment Construction

[0038] Embodiments of the present invention will be described below with reference to the drawings.

[0039] Hereinafter, the case where the peeling apparatus and peeling method of the laminated body of this invention are used in the manufacturing process of an electronic device is demonstrated.

[0040] Electronic devices refer to electronic components such as display panels, solar cells, and thin-film secondary batteries. Examples of the display panel include a liquid crystal display (LCD: Liquid Crystal Display) panel, a plasma display panel (PDP: Plasma Display Panel), and an organic EL display (OELD: Organic ElectroLuminescence Display) panel.

[0041] Manufacturing process of electronic devices

[0042] Electronic devices are produced by forming functional layers for electronic devices (thin-film transistors (TFTs) and color filters (CFs) in the case of LCDs) on surfaces of substrates made of glass, resin, or metal.

[0043] Before forming a functional layer, the bac...

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Abstract

The invention provides a peeling apparatus and a peeling method for a laminate and a manufacturing method of an electronic device. By using the peeling apparatus for the laminate, a first substrate and a second substrate are stuck in a peelable manner to form a laminate. An interface formed between a first substrate and a second substrate is peeled off from one end towards the other end thereof. The peeling apparatus comprises a support part for supporting the above first substrate of the laminate; a peeling unit composed of an absorption part and a planar first flexible member, wherein the absorption part is arranged on the first flexible member in a freely loading / unloading manner and is used for absorbing the above second substrate of the laminate; and a driving part for deforming the above peeling unit. In this way, the above second substrate of the laminate successively and flexibly deforms from one end towards the other end thereof.

Description

technical field [0001] The present invention relates to a peeling device and a peeling method of a laminate, and a method of manufacturing an electronic device. Background technique [0002] With thinner and lighter electronic devices such as display panels, solar cells, and thin-film secondary batteries, thinner substrates (first substrates) such as glass plates, resin plates, and metal plates used in these electronic devices are expected. [0003] However, if the thickness of the substrate becomes thinner, the handleability of the substrate deteriorates, so it is difficult to form functional layers for electronic devices (thin film transistor (TFT: ThinFilmTransistor) and color filter (CF: ColorFilter)) on the surface of the substrate. [0004] Therefore, a method of manufacturing an electronic device has been proposed in which a glass reinforcing plate (second substrate) is attached to the back surface of the substrate to form a laminate in which the substrate is reinforc...

Claims

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Application Information

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IPC IPC(8): B65H41/00H05K3/00
CPCY02E10/50
Inventor 伊藤泰则宇津木洋滝内圭
Owner ASAHI GLASS CO LTD