Chip mounter surface mounting angle adjusting method and system

Abstract

The invention provides a chip mounter surface mounting angle adjusting method and system. The system includes a plurality of suction nozzles used for adsorption and surface mounting of elements, a suction disc used for mounting the plurality of suction nozzles, a first driving mechanism used for driving each suction nozzle to rotate about the central axis thereof to adjust the chip mounting angle and a second driving mechanism used for driving the suction disc to rotate about the central axis thereof, wherein the first driving mechanism includes a first gear, a driving unit and a plurality of gear sets, each gear set is correspondingly in transmission connection with one of the suction nozzles, and the driving unit is used for driving the first gear to rotate to drive each of the gear sets, so that each of the gear sets drives the corresponding suction nozzle to rotate about the central axis thereof. The chip mounter surface mounting angle adjusting system provided by the invention has the beneficial effects of being simple in structure, saving cost, and being relatively high in efficiency.

Description

technical field [0001] The invention relates to surface mount technology, in particular to a method and system for adjusting the mount angle of a mounter. Background technique [0002] Surface mount technology (Surface Mounting Technology, referred to as SMT) refers to the direct welding of surface mount components (also known as chip components, such as IC, capacitors, resistors, etc.) Mounting technology on the specified position on the surface. Applying surface mount technology to electronic products not only makes the products highly reliable and has more functions, but also makes the products gradually lighter and smaller. The long-term development has made today's SMT technology gradually mature, and it has been widely used in various fields such as manufacturing, computer industry and communication industry. The placement machine is the most important equipment on the SMT production line, and the performance of the placement machine directly affects the work efficie...

AI Technical Summary

Problems solved by technology

The nozzle angle adjustment mechanism is a very important mechanism in the ultra-high-speed placement machine. Since the ultra-high-speed placement machine generally has multiple suction nozzles, this increases the difficulty of designing the nozzle angle adjustment mechanism. If the nozzle angle adjustment Poor mechanism design will directly affect the work efficiency and processing cost of the placement machine

[0004] The traditional high-speed placement machine nozzle adjustment mechanism mainly uses m motors to control the rotation of m nozzles respectively. The disadvantage of this method is that the motion control integration is more troublesome, and each motor must rotate with the corresponding nozzle, so the wiring Complicated and wastes power

The second is to use a motor to drive a friction wheel to rotate, and then let the friction wheel drive m suction nozzles to adjust the angle. The disadvantage of this method is that a circular grating ruler needs to be installed on each suction nozzle, which is costly and When adjusting the angle, the movement of other parts of the placement head should be stopped to allow the friction wheel pair to approach, which increases the time for one cycle of placement of the placement machine

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