Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit board device assembly capable of dust removal

A technology for circuit boards and components, which is applied to electrical components, structural parts of electrical equipment, and cleaning methods using gas flow, etc., can solve problems such as increased installation costs, impact on targeted heat dissipation of heat dissipation chips, and difficulty in maintenance and installation by users.

Inactive Publication Date: 2016-03-02
王天真
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this heat dissipation mode is easy to cause problems of installation and cost increase, and it also brings difficulties to later maintenance
[0003] At present, some cooling devices that can concentrate heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles for users that are difficult to maintain and difficult to install.
If the positioning is inaccurate during the installation process, it will affect the targeted heat dissipation of the cooling chip, thereby affecting the operation stability and reliability of the overall system of the circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board device assembly capable of dust removal
  • Circuit board device assembly capable of dust removal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0009] Combine below Figure 1-2 The present invention will be described in detail.

[0010] A dust-removable circuit board device assembly according to an embodiment includes a circuit board device 12, a hinged frame 9 fixedly arranged at one end of the circuit board device 12, and a cooling plate device 2 connected to the hinged frame 9, wherein The main body block 91 of the hinged frame 9 is provided with a vertical rail groove 10 and a horizontal rail groove 7 for connecting with one end of the vertically slidable clamping positioning block 11 and the horizontally slidable clamping positioning block 5 respectively. One end is slidingly fitted, and the main body block 91 of the hinged frame 9 is also fixedly connected with one end of the vertical guide rod 3 wound with the vertical tension spring 4 and one end of the horizontal guide rod 14 wound with the horizontal tension spring 13 , the other end of the vertical guide rod 3 and the other end of the horizontal guide rod ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A circuit board device assembly capable of dust removal comprises a circuit board device (12), a hinged rack (9) and a cooling plate device (2), wherein the hinged rack (9) is fixed at one end of the circuit board device (12), the cooling plate device (2) is connected with the hinged rack (9), a vertical guide rail groove (10) and a horizontal guide rail groove (7) are arranged on a main body block (91) of the hinged rack (9) and used for respectively matched with one end of a clamping positioning block (11) which can slide vertically and one end of clamping positioning block (5) which can slide horizontally in a sliding way, and the main body block (91) of the hinged rack (9) is further fixedly connected with one end of a vertical guide rod (3) wound with a vertical extension spring and one end of a horizontal rod (14) wound with a horizontal extension spring.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a dust-removable circuit board assembly. Background technique [0002] In the field of circuit boards, it is often necessary to conduct targeted heat dissipation for heat dissipating components in the circuit board, such as high-power chips. Now it is often used to install a separate cooling fan on these chips to achieve effective heat dissipation. However, this heat dissipation mode is easy to cause problems of installation and cost increase, and also brings difficulties to later maintenance. [0003] At present, some cooling devices capable of centralized heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles that are difficult to maintain and difficult to install for users. If the positioning is not accurate during the installation process, it will affect the targeted heat dissipation of the cooling chip, thereby affecting the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K7/20B08B5/04
CPCH05K7/20136B08B5/04
Inventor 王天真
Owner 王天真