A compression ring pressing mechanism

Abstract

The invention discloses a press-ring compression mechanism, relates to the technical field of semiconductor manufacturing equipment, and aims at solving a problem that a gap between a to-be-machined workpiece and a substrate is not uniform. The mechanism comprises a press ring and a balance weight ring, which are located in a reaction cavity. The balance weight ring is located below the press ring, and is connected with the press ring. The axis of the balance weight ring and the axis of the press ring are located in the same line. The mechanism also comprises a drive device located outside the reaction cavity, and also comprises a transmission assembly, wherein one end of the transmission assembly is connected with the drive device, and the other end of the transmission assembly contacts with or is separated from the balance weight ring. The drive device drives the press ring and the balance weight ring to rise or fall through the drive assembly. Moreover, the transmission assembly continues to rise to be separated from the balance weight ring in a falling process of the press ring after the press ring contacts with the to-be-machined workpiece on the substrate. When the mechanism fixes the to-be-machined workpiece, the stress applied to the workpiece is uniform, thereby enabling the gap between the workpiece and the substrate to be uniform.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing equipment, in particular to a pressing ring pressing mechanism. Background technique [0002] In existing semiconductor manufacturing equipment such as plasma etching equipment, a base is usually provided at the bottom of the reaction chamber to support and place the workpiece to be processed. However, due to the large amount of heat generated during the plasma etching process, the existence of these heat will affect the etching rate and etching quality of the workpiece. For this reason, a commonly used technical method is to use a water-cooled chuck to Supports and cools workpieces placed on water-cooled chucks. see figure 1 , the water-cooled chuck includes: a chuck body 10 , a plurality of vent holes 11 arranged on the chuck body 10 , and a sealing ring 12 located at the edge of the chuck body 10 . Before plasma etching, the workpiece 20 to be etched is placed on the chuc...

AI Technical Summary

Problems solved by technology

[0005] Although it is possible to compress and fix the workpiece 20 on the chuck body 10 by utilizing the above-mentioned press ring pressing mechanism, the inventors of the present application found that in the process of realizing the present invention: in the existing press ring pressing mechanism, due to three The respective dimensional tolerances, strength tolerances, and assembly tolerances of the three springs 53 in the sleeve 52 make it difficult for the rebound forces produced by the three springs 53 to be the same, so that the force on the workpiece 20 is uneven, thereby causing the workpiece 20 to be in contact with the chuck. The uneven gap between the main bodies 10 causes uneven temperature distribution of the entire workpiece 20 during the plasma etching process, thereby seriously affecting the quality of plasma etching

Images