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Method of mounting chip on printed circuit board

A printed circuit board and chip technology, which is applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of installation complexity and cost

Inactive Publication Date: 2018-11-27
SUNASIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although U.S. Patent No. 5,045,921 provides a tape-shaped substrate for the bonding between the die and the printed circuit board, which is an innovative invention, it is also the tape-shaped substrate that causes installation complexity and additional costs

Method used

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  • Method of mounting chip on printed circuit board
  • Method of mounting chip on printed circuit board
  • Method of mounting chip on printed circuit board

Examples

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Embodiment Construction

[0020] The present invention will be described more specifically by referring to the following examples.

[0021] For an illustration of an example, see Figure 3 to Figure 10 . image 3 It is a flowchart of a method for mounting a chip on a printed circuit board according to an embodiment of the present invention. Figure 4 to Figure 9 for description image 3 A schematic diagram of the steps. Figure 10 It is a top view of a chip 300 and a printed circuit board 100 after applying the method.

[0022] The first step of the method of the present invention is to provide a chip 300 and a printed circuit board 100 (ie image 3 Step S01). According to the present invention, the chip 300 is in the form of a die, rather than a packaged integrated circuit. Without the package portion of conventional packaged integrated circuits, the chip 300 can be assembled with a thinner thickness, and the thickness of the final product to which the chip 300 is applied can be reduced. In app...

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PUM

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Abstract

The invention discloses a method of mounting a chip on a printed circuit board. The method comprises the steps of providing a chip having a plurality of bonding pads and a printed circuit board having a concave portion and a plurality of connecting portions; gluing the concave portion; placing the chip into the concave portion; and forming a circuit pattern to connect the associated bonding pads and the connecting portions. The concave portion has a substantially flat bottom and a shape approximating but larger than the shape of the chip, so that the chip can be fixed to the inside of the concave portion after the gluing step.

Description

technical field [0001] The present invention relates to a method for installing chips, in particular to a method for installing chips on a printed circuit board. Background technique [0002] Silicon chips, or integrated circuits, are the core components of electronic devices, often found in packages. With the development of manufacturing technology and the demand for lightweight design popularized on end products, various packaging methods have also been invented to meet this demand. Most of the time, the silicon chip is sealed in a protective material, such as epoxy. In some cases, especially when the silicon chip is a sensor device, such as a fingerprint recognition chip, the silicon chip needs to be mounted on a substrate with a certain part of the surface exposed. In addition, for fingerprint recognition devices, the thickness of the packaged sensor must be as thin as possible. Therefore, the technique of bonding the silicon chip to the substrate plays a very importa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/58H01L21/60
CPCH01L2224/16225H01L2224/18H01L2224/29139H01L2224/2919H01L2224/32225H01L2224/73204H01L2224/73267H01L2224/83192H01L2224/92244H01L2924/15153H01L2924/00
Inventor 林继周和正平
Owner SUNASIC TECH