Quick readout circuit for two-dimensional resistive sensor array and readout method thereof

A resistive sensor and readout circuit technology, applied in the sensor field, can solve the problem of low data readout rate, and achieve the effects of high scanning speed, shortened cycle, and improved inspection speed

Inactive Publication Date: 2016-03-23
SOUTHEAST UNIV
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Problems solved by technology

[0008] The technical problem to be solved by the present invention is to overcome the defect that the data readout rate of the existing two-dimensional resistive sensor array is low, and provide a fast readout circuit and a readout method of the two-dimensional resistive sensor array, thereby greatly improving the two-dimensional resistive sensor array. Data Readout Rate of a 3D Resistive Sensor Array

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  • Quick readout circuit for two-dimensional resistive sensor array and readout method thereof
  • Quick readout circuit for two-dimensional resistive sensor array and readout method thereof
  • Quick readout circuit for two-dimensional resistive sensor array and readout method thereof

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Embodiment Construction

[0035] The technical scheme of the present invention is described in detail below in conjunction with accompanying drawing:

[0036] The idea of ​​the present invention is to solve the problem that the existing sensor array can only read a single sensor data at a time. Based on the dual voltage feedback method, a fast reading method for a two-dimensional resistive sensor array that shares row lines and column lines is designed. The circuit can read two sensor data at a time, and ideally can double the speed of resistance sensor array resistance measurement, greatly improving the detection efficiency.

[0037] figure 1 The structure of a two-dimensional resistive sensor array sharing row and column lines is shown. Such as figure 1 As shown, the sensor array includes two sets of orthogonal lines as shared row lines and shared column lines respectively and an array of physical quantity sensitive resistors (ie, resistive sensors) distributed in a two-dimensional structure of M×N...

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Abstract

The invention discloses a quick readout circuit for a two-dimensional resistive sensor array and a readout method thereof, wherein the quick readout circuit and the readout method belong to the technical field of sensors. The quick readout circuit comprises the components of a line multiplexer, a row multiplexer, a scanning controller, a first voltage feedback circuit, a second voltage feedback circuit, a sampling resistor and a testing voltage input end. In reading out, a certain row is selected through the row multiplexer; a line is selected from each of two line sets which are connected in a grouped manner through the line multiplexer; two to-be-tested sensors at crossings between the lines and the row are simultaneously selected; and the resistances of the two to-be-tested sensors are calculated according to a testing voltage, an input-end voltage of the first voltage feedback circuit, and a sampling resistance. The quick readout circuit and the readout method are based on a double-voltage feedback method; data of two sensors can be read in one time; and the speed for testing the resistance of the resistive sensor array can be improved by one time, thereby greatly improving testing efficiency.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a fast readout circuit of a two-dimensional resistive sensor array and a readout method thereof. Background technique [0002] The array sensing device is to combine multiple sensing elements with the same performance according to the structure of a two-dimensional array. It can change or generate corresponding shapes and characteristics by detecting changes in parameters focused on the array. This feature is widely used in biosensing, temperature tactile and thermal imaging based on infrared sensors, etc. [0003] Resistive sensing arrays are widely used in infrared imaging simulation systems, force tactile sensing and temperature tactile sensing. Taking temperature touch as an example, since the temperature sensing device involves the transfer of heat and the perception of temperature, in order to obtain the thermal properties of the object, the device puts forward higher requ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D21/02G01D5/16
CPCG01D5/16G01D21/02
Inventor 吴剑锋何赏赏王愚李建清
Owner SOUTHEAST UNIV
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