A kind of chip fuse manufacturing method

Abstract

The invention discloses a chip fuse and a manufacturing method thereof. The method comprises the steps as follows: (S1) a screen plate is put on a thin-film ceramic substrate; an electrode paste is printed on the screen plate; and the electrode paste passes through an electrode pattern hole of the screen plate and is attached to the thin-film ceramic substrate; (S2) the electrode paste on the thin-film ceramic substrate is solidified into a fused electrode; (S3) the screen plate is separated from the thin-film ceramic substrate to obtain a ceramic green chip; and (S4) a plurality of ceramic green chips are stacked to form a ceramic green body; and the ceramic green body is sintered. According to the manufacturing method of the chip fuse, the design requirements of the width and the thickness of the fused electrode can be met; the quality uniformity of the fused electrodes between different individuals can be ensured, so that the chip fuse with a high-precision fusing current is fabricated.

Description

【Technical field】 [0001] The invention relates to the field of manufacturing electronic components, in particular to a chip fuse and a manufacturing method thereof. 【Background technique】 [0002] Chip fuse is also called chip fuse, which is defined by IEC127 standard as "fuse-link", which is a circuit protection component installed in the circuit to ensure the safe operation of the circuit. The fuse is actually a short-circuit protector, which is widely used in power distribution systems and control systems. It is mainly used for short-circuit protection or severe overload protection. It acts as a wire under normal conditions. When the current flowing through the fuse exceeds the specified range, The fuse will be blown quickly due to overload, thus playing a role in protecting the circuit and preventing the occurrence of faults. [0003] When the fuse is working, when the current flows through the fusing electrode, the electrode will generate heat, and the heat generation ...

AI Technical Summary

Problems solved by technology

[0006] 1. Differences in surface conditions of thin film ceramic substrates;

[0007] 2. Differences in rheological properties of printing paste;

[0008] 3. The amount of film under different positions of the screen is different, such as the position of the screen nodes and mesh holes;

[0009] 4. Differences in ambient temperature and humidity;

[0010] 5. Differences in printing parameters, such as printing speed, screen gap Gap value, printing pressure, etc.

[0011] Taking the printed 200μm wide fuse electrode as an example, its width range is as high as ±15um, and the electrode thickness range is as high as ±5um, which directly causes the quality of the fuse electrode to vary greatly between individual products, and then shows the fusing current between different products when used by the client. There is a difference with the fusing time, and the consistency of the protection level becomes worse

Images