A device for feeding silicon wafers
A technology of silicon wafers and silicon wafer boxes, which is applied in the direction of transportation and packaging, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of reducing production speed, increasing chip picking time, and limiting production capacity, so as to improve equipment production capacity and time The effect of shortening and shortening the feeding time
Active Publication Date: 2018-07-24
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] The existing silicon wafer feeding device usually uses the electric slide table to drive the vacuum suction cup to take out the silicon wafer in the silicon wafer box. In this process, the electric slide table needs to reciprocate once to take out a silicon wafer. During the process, acceleration and deceleration are required, which increases the taking time, reduces the production speed, and limits the production capacity
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0018] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.
[0019] figure 1 and figure 2 Shown is an embodiment of the silicon wafer feeding device of the present invention, the silicon wafer feeding device comprises a feeding mechanism 15, a vacuum adsorption area 16, a silicon wafer conveyor belt 9 and a transfer mechanism 17, and the feeding mechanism 15 includes a Place the silicon wafer box 3 of the silicon wafer stack 7 formed by stacking a plurality of silicon wafers 8 and the lifting drive element 18 that drives the silicon wafer stack 7 in the silicon wafer box 3. The silicon wafer conveyor belt 9 and the vacuum adsorption area 16 are located on the silicon wafer Above the box 3, the silicon wafer conveyor belt 9 is horizontally arranged and passes through the vacuum adsorption area 16. The vacuum adsorption area 16 is provided with a vacuum adsorption element 19, and the part of th...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a silicon chip feeding device. The silicon chip feeding device comprises a feeding mechanism, a vacuum absorption zone, a silicon chip conveying belt and a carrying transshipment mechanism, wherein the feeding mechanism comprises a silicon chip box used for disposing a silicon chip pile formed by laminating multiple silicon chips and a lifting driving element which drives the silicon chip pile in the silicon box to realizing lifting, the silicon chip conveying belt and the vacuum absorption zone are respectively arranged above the silicon chip box, the silicon chip conveying belt is horizontally arranged and penetrates through the vacuum absorption zone, the vacuum absorption zone is internally provided with a vacuum absorption element, and the part of the silicon chip conveying belt at the vacuum absorption zone cooperates with the vacuum absorption element to absorb silicon chips in the silicon chip box and drive the silicon chips to move on the carrying transshipment mechanism. The silicon chip feeding device is advantaged in that silicon chip feeding time is shortened, and production efficiency and equipment capacity are improved.
Description
technical field [0001] The invention relates to the technical field of solar cell manufacturing automation equipment, in particular to a silicon wafer feeding device. Background technique [0002] The existing silicon wafer feeding device usually uses the electric slide table to drive the vacuum suction cup to take out the silicon wafer in the silicon wafer box. In this process, the electric slide table needs to reciprocate once to take out a silicon wafer. During the process, acceleration and deceleration are required, which increases the taking time, reduces the production speed, and limits the production capacity. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a silicon wafer feeding device with simple structure, shortened silicon wafer feeding time, high wafer taking efficiency and high production capacity. [0004] In order to solve the problems of the technol...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/683
CPCH01L21/67778H01L21/6838
Inventor 陈勇平郭立樊坤龙辉
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP