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Method for aligning wafer in transverse horizontal direction

A horizontal alignment, wafer technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as crosstalk, manual horizontal adjustment of wafers, etc., and achieve the effect of improving accuracy and fast and accurate adjustment

Active Publication Date: 2016-03-23
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent mainly solves the crosstalk problem caused by ground potential fluctuations in the wafer multi-test object parallel test system, but does not solve the above-mentioned problem of manual horizontal adjustment of the wafer

Method used

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  • Method for aligning wafer in transverse horizontal direction
  • Method for aligning wafer in transverse horizontal direction
  • Method for aligning wafer in transverse horizontal direction

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Embodiment Construction

[0032] The invention discloses a method for horizontal alignment of wafers, which is applied to a parallel testing system. figure 1 A schematic diagram of the structure of the parallel test system of the present invention, such as figure 1 As shown, since several probe cards 5 of the parallel test system 2 are arranged on the wafer carrier 1, and each row of probe cards 5 is horizontally horizontal, each probe card 5 will be inserted on the wafer carrier 1 during the test The position of the wafer to be tested, therefore, the wafer ( figure 1 (not shown in ) must be aligned horizontally to ensure the accuracy of the test.

[0033] The above-mentioned parallel testing system 2 includes a wafer carrying tray 1, which can rotate the wafer carrying tray 1 by rotating an angle knob (not shown in the figure), so as to drive the fixed to-be-received on the wafer carrying tray 1. Wafer measurement (not shown in the figure), a microscope 4 is arranged above the wafer carrier plate to...

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Abstract

The invention provides a method for aligning a wafer in a transverse horizontal direction, wherein the method is applied in a parallel testing system. Through arranging corresponding angle scales on a display device and a turn button, when a water offsets from a transverse horizontal position, the scales on the display device represent the offset angle of the wafer, and accurate adjustment to the wafer in the transverse horizontal direction can be quickly and accurately realized through adjusting the turn button on a wafer carrying plate for a corresponding angle.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for lateral horizontal alignment of wafers. Background technique [0002] In the parallel test system, 4X4 probe cards are distributed above the wafer carrier, and each row of probe cards is horizontally horizontal. Therefore, it is required that the wafers placed on the wafer carrier must be horizontally horizontal. [0003] The current lateral alignment method of the parallel test system cannot know the actual angle that the wafer deviates from the lateral level. It depends on the engineer to manually estimate the offset angle, and then repeatedly adjust it until it is considered to be leveled. This method causes the alignment time to be relatively long. For a long time, the leveling is not accurate enough, which will cause inconvenience to the test, and may damage the probe card in severe cases. [0004] Leveling method in the prior art: 1) first align the ...

Claims

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Application Information

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IPC IPC(8): H01L21/68
Inventor 吴奇伟尹彬锋王炯
Owner SHANGHAI HUALI MICROELECTRONICS CORP