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Height measuring device and method for measuring height of developing solution nozzle

A technology for measuring height and developing solution, applied in the direction of measuring device, mechanical measuring device, using mechanical device, etc., can solve the problems of inability to meet process requirements, inaccurate measurement, plug gauge wear and deformation measurement results, etc., to achieve reading Convenience, easy operation, accurate results

Active Publication Date: 2016-03-30
WUHAN XINXIN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the plug gauge can only determine a range of heights and cannot be measured accurately, and sometimes cannot meet the process requirements when the critical dimensions are gradually reduced
Moreover, the wear and deformation of the plug gauge itself also has an impact on the measurement results

Method used

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  • Height measuring device and method for measuring height of developing solution nozzle
  • Height measuring device and method for measuring height of developing solution nozzle
  • Height measuring device and method for measuring height of developing solution nozzle

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Embodiment Construction

[0037] The principles and features of the present invention will be described below with reference to the accompanying drawings. The examples cited are only used to explain the present invention, and are not used to limit the scope of the present invention.

[0038] Such as figure 1 with figure 2 As shown, a device for measuring height includes a bottom plate 1, one end of the bottom plate 1 is vertically installed with a hydraulic cylinder 2, and the top of the first piston 21 of the hydraulic cylinder 2 is provided with a connecting rod 22; the bottom plate 1 A linear guide 3 is vertically installed on the other end of the linear guide 3, and a slider 31 that can move in the vertical direction is provided on the linear guide 3; it also includes a measuring board 4 parallel to the bottom plate 1; One end is fixed to the connecting rod 22, and the other end is fixed to the slider 31; the hydraulic cylinder 2 communicates with the syringe 6 through the connecting pipe 5, and the c...

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Abstract

The invention relates to a height measuring device and a method for measuring the height of a developing solution nozzle. The device is placed on the upper surface of a wafer, and the lower surface of a bottom plate is pressed against the upper surface of the wafer. The developing solution nozzle is moved to a spraying position and a second piston is pushed. In this way, the upper surface of a measurement plate is driven to press against the lower end of the developing solution nozzle. Meanwhile, the height difference between the upper surface of the measurement plate and the lower surface of the bottom plate is measured in the form of a scale. The scale is just the height of the developing solution nozzle relative to the wafer. Therefore, the height measurement of the developing solution nozzle relative to the wafer is convenient in operation and accurate in result.

Description

Technical field [0001] The present invention relates to the technical field of semiconductor lithography, in particular to a device for measuring height and a method for measuring the height of a developer nozzle. Background technique [0002] In the semiconductor photolithography process, the height of the developer nozzle relative to the wafer is a key parameter in machine maintenance. The height of the developer nozzle is too high or too low, or the levelness is not up to standard, which will not only affect the uniformity of the key dimensions of the graphics, but also cause process defects. [0003] Because of the irregular shape of the developer nozzle, it is impossible to directly measure its height in a conventional way. Currently, a plug gauge is commonly used to measure the height of the developer nozzle, that is, whether a plug gauge of a specific thickness can pass through the gap between the developer nozzle and the wafer to determine whether the developer nozzle heig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B5/06
CPCG01B5/061
Inventor 詹云
Owner WUHAN XINXIN SEMICON MFG CO LTD
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