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LED lead frame with waterproof function and manufacturing method thereof

A lead frame and manufacturing method technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as unfavorable adhesion, and achieve the effects of improving waterproof performance and high manufacturing accuracy

Active Publication Date: 2019-02-05
SHENZHEN WANXINGRUI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surface of the lead frame is usually flat and smooth, which is not conducive to attachment

Method used

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  • LED lead frame with waterproof function and manufacturing method thereof
  • LED lead frame with waterproof function and manufacturing method thereof
  • LED lead frame with waterproof function and manufacturing method thereof

Examples

Experimental program
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Embodiment Construction

[0042] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings. In the description of the LED lead frame of the present invention, it should be understood that terms such as "front", "rear", "upper" and "lower" are only for the convenience of describing the present invention, rather than indicating the means or components referred to. It must have a specific orientation, so it should not be construed as a limitation of the present invention.

[0043] Such as Figure 1-5 As shown, a LED lead frame with waterproof function in a preferred embodiment of the present invention includes at least one lead frame unit formed on the lead frame sheet material, each lead frame unit includes pins, and the pins include opposite The sheet-shaped first pin 11 and the sheet-shaped second pin 12 are ar...

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PUM

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Abstract

The invention discloses a waterproof LED lead framework. The waterproof LED lead framework comprises at least a lead framework unit formed in lead framework sheet matal; each lead framework unit comprises pins; the pins comprise a flake-shaped first pin and a flake-shaped second pin that are arranged in opposite; the front edge of the first pin is opposite to the front edge of the second pin; first waterproof grooves are formed in the pins; and the first waterproof grooves are formed in the front surfaces and / or back surfaces of the pins, and formed along the two side edges of the pins. The LED lead framework is provided with the waterproof grooves, so that the waterproof performance of the LED is effectively improved; the invention also discloses a manufacturing method for the LED lead framework; the manufacturing method comprises the steps of forming outline holes of the first pin and the second pin firstly, then forming the first waterproof grooves and stage-shaped edges, and finally obtaining two pins by separation. The deformation of the LED lead framework in the manufacturing process of the LED lead framework is effectively prevented.

Description

technical field [0001] The invention relates to the field of integrated circuit devices, in particular to an LED lead frame with waterproof function and a manufacturing method thereof. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a structural member that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. It acts as a bridge connecting with external wires. The LED lead frame is to realize the electrical connection between the lead-out end of the internal circuit of the LED lamp bead and the external lead. [0003] The waterproof performance of LED is poor, and the leads in the packaged LED protrude out of the package structure. If the LED accidentally encounters water, the water may enter the package structure along the leads, affecting the performance of the LED. [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L2224/97
Inventor 黄平廖达新张全饶家平
Owner SHENZHEN WANXINGRUI TECH CO LTD