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Transfer board used for offset printing and manufacturing method thereof

A pad printing plate and offset printing technology, which is applied in the pad printing plate used for offset printing and its preparation field, can solve problems such as printing degradation of cross parts, and achieve the effect of improving the printing edge

Active Publication Date: 2016-04-06
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Therefore, the present invention has been made in an effort to provide a pad printing plate for offset printing and a method for preparing the same, which can solve the problem when printing patterns with different line widths or pitches when preparing a pad printing plate. Problem of printing deterioration on the cross section caused by touching the bottom

Method used

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  • Transfer board used for offset printing and manufacturing method thereof
  • Transfer board used for offset printing and manufacturing method thereof
  • Transfer board used for offset printing and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] After coating the photoresist on the Cr glass, a groove pattern including a mesh pattern is formed on the glass by sequentially performing an exposure process, a development process, a Cr etching process and a hydrofluoric acid etching process. In this case, the line width of the trench pattern was 3 μm, the etching depth was 0.6 μm, and the ratio of the maximum line width of the intersection portion to the etching depth of the intersection portion was 5.

[0067] The conductive pattern according to Example 1 is schematically below image 3 Indicated.

Embodiment 2

[0069] Example 2 was implemented in the same manner as in Example 1 except that the etching depth of Example 1 was controlled to 0.3 μm. In this case, the ratio of the maximum line width of the intersecting portion to the etching depth of the intersecting portion was 10.

[0070] The conductive pattern according to Example 2 is schematically below Figure 4 Indicated.

Embodiment 3

[0072] Example 3 was implemented in the same manner as in Example 1 except that the etching depth of Example 1 was controlled to 0.2 μm. In this case, the ratio of the maximum line width of the intersecting portion to the etching depth of the intersecting portion was 15.

[0073] The conductive pattern according to Example 3 is schematically below Figure 5 Indicated.

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Abstract

The invention provides a transfer board used for offset printing and a manufacturing method thereof. According to the embodiments, the transfer board used for offset printing is a transfer board including groove patterns. The groove patterns comprise meshed patterns formed by groove lines. The meshed patterns comprise intersection parts formed by contacting or passing through the plurality of lines in the groove lines, and the ratio of the maximum line width of the intersection part and the etching depth of the intersection part is lower than 25.

Description

[0001] Cross References to Related Applications [0002] This application claims priority and benefit from Korean Patent Application No. 10-2014-0130602 filed with the Korean Intellectual Property Office on Sep. 29, 2014, the entire contents of which are hereby incorporated by reference. technical field [0003] The invention relates to a pad printing plate for offset printing and a preparation method thereof. Background technique [0004] In the manufacture of flat panel displays (FPD) such as liquid crystal displays (LCD) or plasma display panels (PDP), it is necessary to form various types of patterns (such as electrodes or black matrices, color filters, partition walls, and thin film transistors) process. [0005] As a process of forming a pattern, a method for forming a pattern by obtaining a photoresist pattern selectively removable by exposure and development by using a photoresist and a photomask, and using the photoresist pattern is often used. The photomask proce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41F13/193B41F17/00
CPCH01L21/0273
Inventor 李东炫黄智泳李承宪徐汉珉林枪润
Owner LG CHEM LTD