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Double-sided metal-clad laminate, printed circuit wiring board, multilayer laminate, and method for manufacturing multilayer printed circuit wiring board

A manufacturing method, a technology for printed circuits, applied in the directions of printed circuit manufacturing, printed circuits, manufacturing of printed circuit precursors, etc.

Active Publication Date: 2018-05-04
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, as Figure 3F As shown, warping occurs in the multilayer printed circuit wiring board 101

Method used

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  • Double-sided metal-clad laminate, printed circuit wiring board, multilayer laminate, and method for manufacturing multilayer printed circuit wiring board
  • Double-sided metal-clad laminate, printed circuit wiring board, multilayer laminate, and method for manufacturing multilayer printed circuit wiring board
  • Double-sided metal-clad laminate, printed circuit wiring board, multilayer laminate, and method for manufacturing multilayer printed circuit wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0101] First, a prepreg layer (first prepreg layer 31 ) is fabricated through the following steps.

[0102] 19 parts by mass of a thermosetting resin, 65 parts by mass of an inorganic filler, 16 parts by mass of a curing agent, and 0.02 parts by mass of a curing accelerator were prepared. And, a spun cloth base material is prepared. Here, "EPPN502H" manufactured by Nippon Kayaku Co., Ltd., which is a polyfunctional epoxy resin, was used as the thermosetting resin. Admatechs Co., Ltd. "SO-C6" (average particle diameter 2 micrometers) which is spherical silica was used as an inorganic filler. As a curing agent, "MEH7600" manufactured by Meiwa Chemical Industry Co., Ltd., which is a phenolic curing agent, was used. 2-Ethyl-4-methylimidazole (manufactured by Shikoku Chemical Industry Co., Ltd.) was used as the hardening accelerator. As the woven fabric substrate, "1017cloth" (thickness: 15 μm) manufactured by Asahi Kasei Co., Ltd., which is a glass cloth, was used.

[0103] A ...

Embodiment 2

[0111] The heating temperature when preheating the laminate 61 was set to 100°C. Except for this, a multilayer laminate was produced under the same conditions as in Example 1.

Embodiment 3

[0113] The heating temperature when preheating the laminate 61 was set to 140°C. Except for this, a multilayer laminate was produced under the same conditions as in Example 1.

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PUM

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Abstract

The present invention relates to a manufacturing method of a double-sided metal laminate, a manufacturing method of a printed circuit board, and a manufacturing method of a multilayer laminate, and a manufacturing method of a multilayer printed circuit board. The manufacturing method of a double-sided metal laminate includes the following steps: forming lamination by inserting a first prepreg layer between a first metal foil and a second metal foil; and molding a laminate by heating and pressurizing the laminate after pre-heating the laminate.

Description

technical field [0001] The present invention relates to a method of manufacturing a double-sided metal-clad laminate, a method of manufacturing a printed wiring board, a method of manufacturing a multilayer laminate, and a method of manufacturing a multilayer printed wiring board. Specifically, it relates to a method of manufacturing a multilayer printed wiring board widely used in various electronic devices such as personal computers, mobile communication telephones, and video cameras, and its material as a material for the multilayer printed wiring board. A preferred method of manufacturing double-sided metal-clad laminates, printed circuit wiring boards, and multilayer laminates. Background technique [0002] In recent years, with the high function and high density of electronic equipment, electronic components tend to be more and more miniaturized, highly integrated, high-speed, and multi-pin. Along with this, the demand for higher density, smaller diameter, lighter wei...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/02
CPCH05K3/022
Inventor 福住浩之小山雅也宇野稔
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD