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Component pick-up heads for surface mount machines

A technology for placement machines and components, applied in electrical components, electrical components, etc., can solve problems such as sufficient detection accuracy, and achieve the effects of improving detection accuracy, controlling descending stroke, and smooth lifting

Active Publication Date: 2020-07-21
HANWHA AEROSPACE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this regard, conventionally, the optical axis of the light emitted by the light emitting unit is oriented toward the main axis in the vertical direction of the nozzle to be detected, but this cannot be regarded as necessarily sufficient detection accuracy.

Method used

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  • Component pick-up heads for surface mount machines
  • Component pick-up heads for surface mount machines
  • Component pick-up heads for surface mount machines

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] Hereinafter, the present invention according to preferred embodiments will be described in detail with reference to the accompanying drawings. In addition, in this specification and drawings, the same code|symbol is used for the component which has substantially the same structure, and overlapping description is abbreviate|omitted.

[0045] figure 1 It is a perspective view showing the overall configuration of a component suction head according to an embodiment of the present invention.

[0046] Such as figure 1 As shown, the component holding head 10 is a rotary head type component holding head, and the rotary head 40 is mounted on the head main body (main frame) 20 so as to be rotatable in the R direction around the vertical axis. In the spin head 40, a plurality of main shafts 41 are arranged at equal intervals along the circumferential direction, and a suction nozzle 42 is attached to the lower end of each main shaft 41 as a component holding mechanism for sucking...

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PUM

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Abstract

The invention discloses a component holding head of surface placement equipment. The component holding head comprises a head main body, a rotating head, a plurality of main shafts, a component holding mechanism, a reflective optical sensor. The rotating head is rotatably installed on the head main body along an R direction on the periphery of a vertical shaft. The plurality of main shafts are arranged along the peripheral direction of the rotating head. The component holding mechanism is arranged on a central shaft and is used to pick up or mount a component. The reflective optical sensor is used to detect the component holding mechanism which rotates along the R direction and is on a specific position. And a light reception portion, an optical sensing mechanism is configured with an illuminating portion and a light reception portion. The illuminating portion illuminates the reflection surface of a component fixing mechanism on the specific position. The light reception portion receives the reflective light reflected by the reflection surface, and the optical axis of the light illuminated by the illuminating portion is arranged in a bias manner, so that the optical axis in the part of the reflection surface faces on a further rotation position from the position on the vertical direction central axis of the component holding mechanism on the specific position along the rotating direction of the R direction.

Description

technical field [0001] The present invention relates to a component suction head provided with a component fixing mechanism for fixing components in a surface mounter for mounting IC chips and other components (electronic components) on a substrate. Background technique [0002] Generally speaking, the surface mount mechanism is such that the component suction head is moved to the upper part of the component supply part, where the suction nozzle equipped with the component suction head as the component support mechanism is lowered / raised to vacuum-adsorb the component. The lower end of the suction nozzle is picked up, and then the component suction head is moved to the top of the substrate, and then the suction nozzle is lowered / raised again above the substrate to mount the component on the predetermined coordinate position of the substrate. [0003] As mentioned above, when the suction nozzle is lowered / raised to pick up parts, if the downward stroke of the suction nozzle i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
Inventor 北田进谷崎昌裕藤原哲夫堤卓也
Owner HANWHA AEROSPACE CO LTD
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