Temperature value detection method based on intelligent terminal and intelligent terminal

Abstract

The invention provides a temperature value detection method based on an intelligent terminal and the intelligent terminal. The detection method includes the steps that S10, a current temperature value of a machine body of the intelligent terminal is acquired; S20, the current temperature value is compared with pre-warning temperature values; S31, when the current temperature value is larger than a first preset temperature value in the pre-warning temperature values, current brightness of a display screen of the intelligent terminal is acquired; S41, the current brightness of the display screen of the intelligent terminal is adjusted to be in a progressive-decrease state till the current temperature value is lower than the first preset temperature value; S10 is repeated. The intelligent terminal comprises a module containing executable instructions so that the method can be executed. By means of the method, user experience and system reliability are improved.

Description

technical field [0001] The invention relates to the detection field, in particular to a temperature value detection method based on an intelligent terminal and the intelligent terminal. Background technique [0002] With the rapid development of the industry, the configuration of smart terminals continues to improve, the computing speed continues to accelerate, and the CPU frequency is also getting higher and higher. When running multi-programs and multi-functions, the temperature value of the main board is bound to rise continuously. This is not only a test for the working performance and life of the device, but also the temperature value of the main board radiates to the shell of the smart terminal through conduction, which also affects the user's subjective experience. . [0003] In addition, the current heat dissipation methods mainly focus on passive heat dissipation, that is, adding graphite sheets, foam and thermal silica gel, etc., which not only wastes the cost of ...

AI Technical Summary

Problems solved by technology

When running multi-programs and multi-functions, the temperature value of the main board is bound to rise continuously. This is not only a test for the working performance and life of the device, but also the temperature value of the main board radiates to the shell of the smart terminal through conduction, which also affects the user's subjective experience.

[0003] In addition, the current heat dissipation methods mainly focus on passive heat dissipation, that is, adding graphite sheets, foam and thermal silica gel, etc., which not only wastes the cost of the whole machine, but also has some hindsight in dealing with problems

It directly affects the subjective experience of customers, which reduces the user experience and affects the performance and lifespan of smart terminals.

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