Unlock instant, AI-driven research and patent intelligence for your innovation.

Equipment front-end module device and silicon wafer alignment method

A silicon wafer alignment and equipment technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of low equipment productivity, long time consumption, and complex front-end device structure.

Inactive Publication Date: 2016-04-20
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The front-end device of the equipment in the prior art needs to transfer the silicon wafer to the alignment chamber for alignment and rotation, which results in a long time-consuming time for the silicon wafer to be installed at the front-end of the equipment, the structure of the front-end device is complicated, and the production capacity of the equipment is low, which reduces the Efficiency of Silicon Transmitting and Receiving

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Equipment front-end module device and silicon wafer alignment method
  • Equipment front-end module device and silicon wafer alignment method
  • Equipment front-end module device and silicon wafer alignment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to make the purpose, technical solution and advantages of the present invention clearer, the following will further describe the implementation of the present invention in detail in conjunction with the accompanying drawings. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0032] The above and other technical features and beneficial effects will be described in detail with reference to the embodiments and the accompanying drawings for the equipment front-end device and silicon wafer alignment method proposed by the present invention. figure 2 It is a schema...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of semiconductor integrated circuit manufacturing, and discloses an equipment front-end module device and a silicon wafer alignment method. The equipment front-end module device comprises loading units, graphical comparison systems and a mechanical arm. The end of the mechanical arm is provided with a rotating device and a vacuum hole. The deviation angle between the actual positions of silicon wafer alignment slots and the standard positions of preset alignment slots is obtained through the graphical comparison systems, and a silicon wafer is rotated by the rotating device so as to rotate the actual positions of the silicon wafer alignment slots to the standard positions of the preset alignment slots. The situation in which a silicon wafer is transmitted to an alignment cavity and then aligned and rotated in the prior art is avoided, the time for silicon wafer alignment at the equipment front-end module device is reduced, the structure of the equipment front-end module device is simplified, the equipment capacity is greatly improved, and the efficiency of silicon wafer transmitting and receiving is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor integrated circuit manufacturing, and relates to a front-end device of equipment and a method for aligning silicon wafers. Background technique [0002] With the development of semiconductor technology, semiconductor manufacturing has increasingly stringent requirements on plant utilization and production cycle. How to reduce the production time of silicon wafers is an important factor to increase the production capacity of semiconductor factories. Silicon wafers have to go through hundreds of process steps from being put into manufacturing to finishing processing, and almost every process step has to enter and exit the process equipment once. Due to the high degree of automation of 300mm process equipment, the current mainstream process equipment, in addition to the mainframe used for silicon wafer processing, also has an equipment front end (EquipmentFrontEndModule, EFEM) for silicon wafer...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/673H01L21/68H01L21/687
CPCH01L21/673H01L21/68H01L21/68714
Inventor 李佳青
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT