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Improving plating performance using a combination of metal oxides and metal powders as additives

A technology of additives and metal components, used in liquid chemical plating, metal material coating process, electrical components, etc., can solve problems such as polymer degradation, changes in the overall performance of ductile materials, and damage to the pH of the polymer matrix surface.

Active Publication Date: 2017-10-03
SHPP GLOBAL TECH BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the different electroless plating solutions and conditions used, the plating performance of traditional LDS materials may change in aspects such as plating rate and plating adhesion
Additionally, some LDS fillers have a surface pH that can damage the polymer matrix during handling, resulting in polymer degradation
This degradation of the polymer matrix results in, for example, a reduction in the ductility of the final composition
Altered ductility, as well as changes in other properties, may result in substantial and potentially undesirable changes in the overall properties of the material

Method used

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  • Improving plating performance using a combination of metal oxides and metal powders as additives
  • Improving plating performance using a combination of metal oxides and metal powders as additives
  • Improving plating performance using a combination of metal oxides and metal powders as additives

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0085] Embodiment 1: Blended thermoplastic compositions comprising: (a) from about 20 wt% to about 80 wt% polycarbonate polymer component; (b) from about 5 wt% to about 30 wt% polycarbonate-polysiloxane (c) a laser direct structuring additive component from about 1 wt% to about 20 wt%; and (d) a metal component from about 0.02 wt% to about 5 wt%; wherein the combined weight of all components Percentage values ​​do not exceed about 100% by weight, and where all weight percent values ​​are based on the total weight of the composition.

Embodiment approach 2

[0086] Embodiment 2: The composition according to Embodiment 1, wherein the blended thermoplastic composition is capable of being plated.

Embodiment approach 3

[0087] Embodiment 3: The composition according to Embodiment 1 or 2, wherein the blended thermoplastic composition has a plating index of from about 0.7 to about 2.0 when determined according to ASTM B568.

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Abstract

The present disclosure relates to blended thermoplastic compositions comprising: a) from about 20 wt% to about 80 wt% polycarbonate polymer component; b) from about 5 wt% to about 30 wt% polycarbonate-polysiloxane copolymer c) from about 1 wt% to about 20 wt% of the laser direct structuring additive component; and d) from about 0.02 wt% to about 5 wt% of the metal component; wherein the combined weight percent value of all components does not exceed About 100 wt%, and wherein all weight percent values ​​are based on the total weight of the composition.

Description

technical field [0001] The present invention relates to a laser direct structuring additive comprising one or more polycarbonate polymers, one or more polycarbonate-polysiloxane copolymers, one or more laser direct structuring additives, and one or more metal components A blended thermoplastic composition, wherein the blended polymer composition has improved electroplating properties. Background technique [0002] The electronic assembly may be provided as a molded injection device ("MID") with the desired printed conductors. In contrast to conventional circuit boards manufactured from fiberglass-reinforced plastic, etc., MID components produced in this way are three-dimensional (3D) molded parts with integrated printed conductor layouts and possibly other electronic components or Electromechanical components. The use of this type of MID assembly saves space even if the assembly has only printed conductors and is used to replace conventional wiring inside electrical or ele...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L69/00
CPCC08K3/08C08K3/22C08L69/00C08L83/10H05K3/185H05K2203/072H05K2203/107C08G64/04C08G64/186C08L2201/08C08L2205/025C08L2205/03C08L2205/06C23C18/1641C23C18/28C23C18/38
Inventor 吴彤严彦刚安玉贤林叶刚廉学明
Owner SHPP GLOBAL TECH BV