Cutting method for hard and brittle material substrate

Abstract

A cutting method for a hard and brittle material substrate sequentially includes the following steps that an upper substrate body is cut off along a front side surface of a removal part; under the condition that a rear side surface of the upper substrate body is not cut off, a lower substrate body extension surface, extending to a lower substrate body, of a rear side surface of the removal part is cut off; downward engraving is conducted from the upper surface of the upper substrate body along the rear side surface of the removal part to form an engraving line of a preset depth or a cut-off line from the upper surface of the upper substrate body to the lower surface of the upper substrate body is cut off downwards; and the removal part is broken and pulled away from the hard and brittle material substrate by taking the engraving line as a fulcrum or the removal part is removed from the hard and brittle material substrate along the cut-off line. In this way, the pass yield of hard and brittle material substrates is increased.

Description

technical field [0001] The present invention relates to a hard and brittle material substrate, in particular to a cutting method for a hard and brittle material substrate. Background technique [0002] At present, hard and brittle material substrates are widely used in various parts of electronic products, such as screens and casings. The hard and brittle material substrate includes an upper substrate, a lower substrate and electronic components interposed between the upper substrate and the lower substrate, wherein the upper substrate and the lower substrate are partially fixed by a layer of adhesive. During the manufacturing process of the hard and brittle material substrate, the portion to be removed of the upper substrate is cut and removed, so that the hard and brittle material substrate meets specific product requirements, or the electrical components of the electronic components sandwiched between the upper substrate and the lower substrate Sex contacts are exposed f...

AI Technical Summary

Problems solved by technology

However, the hard and brittle material debris generated during the cutting process of the upper substrate will fall on the upper substrate and it is difficult to completely remove it, especially in the exposed part of the electrical circuit of the electronic component, it is more likely to cause the upper substrate to be scratched during the suction process. damage, leading to a decrease in the yield rate of hard and brittle material substrates

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