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A high-power resonant power supply control chip realized by double-chip packaging

A power control chip, low-voltage control chip technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of high-power resonant power control chip yield reduction, manufacturing difficulty and cost increase, high process requirements, etc., to avoid The effect of unstable chip working state, improving yield rate, and solving heat dissipation problems

Active Publication Date: 2018-01-02
NINGBO SEMICON INT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing high-power resonant power supply control chips are all manufactured by integrating the low-voltage control chip and the high-voltage driver chip in one silicon chip. This not only requires high process requirements, but also requires the integration of high-voltage and low-voltage processes, and the high-power resonance produced by manufacturing The yield rate of the power control chip will also decrease, the difficulty and cost of manufacturing will increase, the price of the chip will be high, and the cost of the overall solution for customer applications will also increase

Method used

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  • A high-power resonant power supply control chip realized by double-chip packaging
  • A high-power resonant power supply control chip realized by double-chip packaging
  • A high-power resonant power supply control chip realized by double-chip packaging

Examples

Experimental program
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Effect test

Embodiment 1

[0022] A high-power resonant power supply control chip implemented by a two-chip package proposed in this embodiment, such as figure 1 and image 3 As shown, it includes a 16-pin lead frame (SOP-16) 81. The lead frame 81 has a package surface 82, and 16 mutually isolated and insulated pins are arranged on the package surface 82, and the first lead Pin to the 16th pin are soft start terminal (CSS), overload current delay shutdown terminal (DELAY), timing capacitor terminal (CF), minimum oscillator frequency setting terminal (RFMIN), intermittent operation mode threshold terminal (STBY ), input current detection terminal (ISEN), input voltage detection terminal (LINE), latch-type drive shutdown terminal (DIS), control channel terminal of the previous PFC controller (PFC_STOP), IC power and signal ground (GND), low Side gate drive output (LVG), power supply (VCC), empty pin (NC), high-side gate drive suspension ground (OUT), high-side gate drive output (HVG), high-side gate driv...

Embodiment 2

[0024] A high-power resonant power supply control chip implemented by a two-chip package proposed in this embodiment, such as figure 2 and image 3 As shown, it includes a 16-pin lead frame (DIP-16) 81. The lead frame 81 has a package surface 82, and 16 mutually isolated and insulated pins are arranged on the package surface 82, and the first lead Pin to the 16th pin are soft start terminal (CSS), overload current delay shutdown terminal (DELAY), timing capacitor terminal (CF), minimum oscillator frequency setting terminal (RFMIN), intermittent operation mode threshold terminal (STBY ), input current detection terminal (ISEN), input voltage detection terminal (LINE), latch-type drive shutdown terminal (DIS), control channel terminal of the previous PFC controller (PFC_STOP), IC power and signal ground (GND), low Side gate drive output (LVG), power supply (VCC), empty pin (NC), high-side gate drive suspension ground (OUT), high-side gate drive output (HVG), high-side gate dri...

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Abstract

The invention discloses a high-power resonant power supply control chip realized by double-chip packaging, which includes a lead frame, the lead frame has a package surface, 16 mutually isolated and insulated lead pins are arranged on the package surface, and the package surface is packaged with The low-voltage control chip made by low-voltage technology and the high-voltage driver chip made by high-voltage technology, the low-voltage control chip has 14 mutually isolated and insulated pins, the high-voltage driver chip has 7 mutually isolated and insulated pins, the low-voltage control chip The chip and the high-voltage driver chip are connected through 2 pins, the 12 pins of the low-voltage control chip are connected to the 12 pins on the package surface, and the 3 pins of the high-voltage driver chip are connected to the 3 pins on the package surface Connection; the advantage is that since the low-voltage control chip and the high-voltage driver chip are manufactured separately, there is no need to use two processes in one chip at the same time, and the two chips are tested separately. Double-chip packaging can improve yield and reduce chip costs.

Description

technical field [0001] The invention relates to a high-power resonant power supply control chip, in particular to a high-power resonant power supply control chip realized by double-chip packaging. Background technique [0002] With the popularity of LCD TVs and high-power commercial LEDs, both LCD TVs and high-power commercial LEDs rely on high-power resonant power supplies to convert alternating current into direct current for work. The advantage of the resonant power supply is that it can achieve constant DC voltage and current output corresponding to the AC voltage input from 90V to 265V, and the AC-DC conversion efficiency is high, and it can provide various protections, such as input undervoltage protection, overcurrent protection, load Short circuit protection, soft start, etc. The core of the resonant power supply is the resonant power supply control chip. [0003] The existing high-power resonant power supply control chips are all manufactured by integrating the lo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495
CPCH01L23/4952H01L2224/48137H01L2224/48247H01L2224/48257H01L2224/49171
Inventor 钟晓辉
Owner NINGBO SEMICON INT CORP
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