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Flexible metal laminate

一种柔性金属、层压板的技术，应用在金属层状产品、涂层、分层产品等方向，能够解决降低热塑性聚酰亚胺层粘合力等问题，达到优化热膨胀系数、低介电常数、高度弹性热膨胀系数的效果

Active Publication Date: 2016-05-25
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] Meanwhile, although flexible metal laminates containing fluororesins represent a low dielectric constant and have excellent applicability on printed circuit boards, fluororesins have been detected in the interface of thermosetting polyimide layers in which fluororesins are dispersed , thereby reducing its adhesion to the thermoplastic polyimide layer

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0106] Preparation Example 1: Preparation of polyamic acid solution (P1) containing fluorine-based resin

[0107] Fill a 1L polyethylene (PE) bottle with nitrogen, and add 765g of dimethylacetamide (DMAc), 160g of polytetrafluoroethylene (PTFE) fine powder (particle size: 0.1 to 2.0μm), And 765 g of beads with a diameter of 2 mm. When the mixture is stirred in a high-speed ball mill, the PTFE is dispersed.

[0108] Add 19.5g of the solution in which PTFE is dispersed, 154g of dimethylacetamide, 12.15g of pyromellitic dianhydride and 17.85g of 2,2'-bis(trifluoromethyl)-4 to a 500mL round bottom flask, 4'-diaminobiphenyl, and stirred with a stirrer, while allowing nitrogen to flow in the mixture at 50 ℃ for 10 hours, thereby obtaining a polyamic acid solution (P1) with a density of about 20,000 cps (in the solid content of PTFE Content: 10% by weight).

preparation Embodiment 2

[0109] Preparation Example 2: Preparation of polyamic acid solution (P2)

[0110] Add 154g of dimethylacetamide, 12.15g of pyromellitic dianhydride and 17.85g of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl to a 500mL round bottom flask, and stir The vessel was stirred while flowing nitrogen in the mixture at 50°C for 10 hours, thereby obtaining a polyamic acid solution (P2) having a density of about 20,000 cps.

preparation Embodiment 3

[0111] Preparation Example 3: Preparation of thermoplastic polyamic acid solution (P2)

[0112] Add 154g of dimethylacetamide, 9g of pyromellitic dianhydride (PMDA) and 17g of 2,2'-bis[4](4-aminophenoxy)phenylpropane into a 500mL round bottom flask, and use a stirrer While stirring, nitrogen was allowed to flow in the mixture at 50°C for 10 hours, thereby obtaining a polyamic acid solution (P3) having a density of about 3000 cps.

[0113] [Example and Comparative Example: Manufacturing of Flexible Metal Laminate]

[0114] On the matte surface of the copper foil (thickness: 12 μm), the polyamic acid solution of the preparation example was applied in the above-mentioned order, and after each application of the polyamic acid solution, it was dried at 100° C. for 10 minutes.

[0115] In addition, after coating and drying were completed, the dried product was started to be heated from room temperature to 350°C in a nitrogen oven and cured at 350°C for 30 minutes.

[0116] After the curing w...

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Abstract

Disclosed herein is a flexible metal laminate including: a first thermosetting polyimide resin layer containing 5 wt % to 75 wt % of a fluorine-based resin; a second thermosetting polyimide resin layer formed on at least one surface of the first thermosetting polyimide resin layer, and containing 1 wt % or less of the fluorine-based resin; and a thermoplastic polyimide resin layer formed on one surface of the second thermosetting polyimide resin layer so as to face the first thermosetting polyimide resin layer, wherein the first thermosetting polyimide resin layer and the second thermosetting polyimide resin layer include the same thermosetting polyimide resin.

Description

[0001] Cross-reference of related applications [0002] This application claims the rights and interests of Korean Patent Application No. 10-2014-0160983 filed at the Korean Intellectual Property Office on November 18, 2014, the disclosure of which is incorporated into this specification by reference in its entirety. Background technique [0003] a) Field of invention [0004] The present invention relates to a flexible metal laminate, and in particular, to a flexible metal laminate that realizes low dielectric constant, high elasticity and optimized thermal expansion coefficient, and has a solid internal structure and high-layer bonding strength. [0005] b) Description of related technologies [0006] Flexible metal laminates are mainly used as the base material of flexible printed circuit boards, and are additionally used in cotton heating elements, electromagnetic shielding materials, flat cables, packaging materials, etc. [0007] Among the flexible metal laminates, there is a flex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08C08L79/08C08L27/18C08L23/08
CPCB32B27/281B32B7/12B32B15/08B32B15/09B32B15/092B32B15/095B32B15/098B32B27/08B32B27/26B32B27/283B32B27/36B32B27/38B32B27/40B32B27/42B32B2255/10B32B2255/205B32B2262/0269B32B2262/101B32B2262/103B32B2262/105B32B2262/106C08L23/0892C08L27/18C08L79/08C08L2205/025
Inventor 朴是映朴谆龙张世明朴永锡
Owner GUANGDONG SHENGYI SCI TECH
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