Box body for refrigeration equipment and semiconductor refrigeration equipment

Abstract

The invention provides a box body for refrigeration equipment and the semiconductor refrigeration equipment. The box body for the refrigeration equipment comprises a shell and two or more spaced metal liners, a thermal insulation connector is arranged between every two adjacent metal liners, and every two adjacent metal liners are connected through the thermal insulation connector; the metal liners are located in the shell, and insulation layers are arranged between the metal liners and the shell. By arranging the spaced metal liners, each metal liner can be provided with an independent semiconductor refrigeration module for refrigeration, storage spaces formed by the different metal liners can form independent temperature zone ranges because the metal liners are spaced, and therefore the refrigerating capacity of the semiconductor refrigeration modules can be controlled according to needs for realizing multi-temperature zone refrigeration, and the refrigeration requirements of different articles are met.

Description

technical field [0001] The invention relates to a refrigeration device, in particular to a box body for refrigeration equipment and a semiconductor refrigeration equipment. Background technique [0002] At present, refrigeration equipment (such as refrigerators, freezers, and wine cabinets) is an electrical appliance commonly used in people's daily life. Refrigeration equipment usually has a refrigeration system. Generally, the refrigeration system is composed of a compressor, a condenser, and an evaporator, which can achieve a lower temperature. of refrigeration. However, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration modules for refrigeration is also widely used. The semiconductor refrigeration equipment in the prior art releases cold energy through the cold end of the semiconductor refrigeration module to cool the storage space in the box. In the actual use process, the cold end of the semiconduc...

AI Technical Summary

Problems solved by technology

In the actual use process, the cold end of the semiconductor refrigeration module is usually connected with a heat pipe, and the cold energy is transferred to the inner tank of the semiconductor refrigeration equipment through the heat pipe for cooling. The inner tank is generally a plastic tank formed by injection molding. The refrigeration temperature is single, and it cannot realize multi-temperature zone refrigeration, and cannot meet the refrigeration requirements of different items

Images