Semiconductor refrigerating equipment

Abstract

The invention provides semiconductor refrigerating equipment. The semiconductor refrigerating equipment comprises a plurality of heat conducting liners arranged at intervals. Each heat conducting liner is provided with a semiconductor refrigerating assembly. The multiple heat conducting liners are arranged in a stacked mode from top to bottom. Each semiconductor refrigerating assembly comprises a semiconductor refrigerating module, a cold-end heat radiator and a hot-end heat radiator, wherein the hot-end heat radiator is connected to the hot end of the semiconductor refrigerating module. Each cold-end heat radiator comprises a first heat conductor and a plurality of first heat pipes, wherein the first heat pipes are connected to the first heat conductor, and the first heat conductor is connected to the cold end of the corresponding semiconductor refrigerating module. The first heat pipes are attached to the heat conducting liners correspondingly. The uppermost heat conducting liner is further provided with an installation plate. The first heat conductors are all installed on the installation plate. By the adoption of the semiconductor refrigerating equipment, multi-temperature-zone refrigeration is achieved, and therefore the refrigerating requirements of different objects are met.

Description

technical field [0001] The invention relates to a refrigeration device, in particular to a semiconductor refrigeration device. Background technique [0002] At present, refrigeration equipment (such as refrigerators, freezers, and wine cabinets) is an electrical appliance commonly used in people's daily life. Refrigeration equipment usually has a refrigeration system. Generally, the refrigeration system is composed of a compressor, a condenser, and an evaporator, which can achieve a lower temperature. of refrigeration. However, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for refrigeration is also widely used. The semiconductor refrigeration equipment in the prior art releases cold energy through the cold end of the semiconductor refrigeration module to cool the storage space in the box. However, in the actual use process, the cooling temperature of semiconductor refrigeration equipment is s...

AI Technical Summary

Problems solved by technology

However, in the actual use process, the cooling temperature of semiconductor refrigeration equipment is single, and it cannot realize multi-temperature zone refrigeration, and cannot meet the refrigeration requirements of different items.

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