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High-elasticity multilayer Balun

A multi-layer balun and high-elasticity technology, applied in the microwave field, can solve the problems of large balun volume and unfavorable integration of circuit components, and achieve the effect of reducing volume and facilitating integration

Inactive Publication Date: 2016-06-01
QINGDAO BOLAIMOSI NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The invention proposes a high-elastic multi-layer balun, which solves the problem that the volume of the balun in the prior art is too large, which is not conducive to the integration of other circuit components

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  • High-elasticity multilayer Balun

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Embodiment Construction

[0013] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0014] figure 1 It is a three-dimensional schematic diagram of an embodiment of a highly elastic multilayer balun of the present invention. Such as figure 1 As shown, the highly elastic multi-layer balun 1 includes a top metal ground 21, a bottom metal ground 22, and a metal shielding layer 3. A window 32 is opened on the metal shielding layer 3, and a wire connection through hole 31 is passed through the window 32. The highly elastic...

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Abstract

The invention provides a high-elasticity multilayer balun comprising a top metal ground and a bottom metal ground, a metal shielding layer, an upper coupling line, a lead connection through hole, and a lower coupling line. A window is formed in the metal shielding layer. The upper coupling line is arranged between the top metal ground and the metal shielding layer; and one end of the upper coupling line is connected to the top metal ground by an upper grounding through hole. One end of the lead connection through hole is connected to the other end of the upper coupling line and the lead connection through hole passes through the window. The lower coupling line is arranged between the bottom metal ground and the metal shielding layer; and one end of the lower coupling line is connected to the bottom metal ground by a lower grounding through hole and the other end of the lower coupling line is connected to the other end of the lead connection through hole. According to the high-elasticity multilayer Balun, the balun size can be effectively reduced and integration of the balun with other circuit elements can be realized conveniently.

Description

Technical field [0001] The invention relates to the field of microwaves, in particular to a highly elastic multilayer balun. Background technique [0002] In the field of radio frequency, baluns are very versatile and need to be used in any place where balanced to unbalanced conversion is required, such as phase detectors, single sideband modulators, balanced mixers and antennas. The microstrip line structure of the balun, especially the Marchand balun, has been widely used because of its simple model analysis and easy coupling with coaxial lines. [0003] The Marchand balun is composed of two identical coupling lines, and the length of each coupling line is a quarter wavelength at the center frequency. Since the length of the coupling line of the Marchand Balun is in the same order of magnitude as the central wavelength, its length is very long. If the Marchand balun is made on a flat surface, its volume is larger. Summary of the invention [0004] The present invention provides...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/10
CPCH01P5/10
Inventor 李姗姗
Owner QINGDAO BOLAIMOSI NEW MATERIAL TECH CO LTD