Manufacturing method of display substrate of display panel

Abstract

The invention provides a manufacturing method of a display substrate of a display panel. The method comprises: a flexible organic light emitting diode (OLED) substrate is provided; a thin-film transistor layer is arranged on the flexible OLED substrate; a bonding layer with patterns is arranged on the thin-film transistor layer which comprises at least one testing region; a blocking film is provided, and a laser blocking layer with patterns is arranged on a surface of the blocking film, the surface of the blocking film facing the thin-film transistor layer; the blocking film is bonded to the flexible OLED substrate, so that at least one part of the laser blocking layer is corresponding to the at least one testing region; a laser beam is used to irradiate the blocking film along the cutting line, so that a first part of the blocking film is removed from a second part of the blocking film.

Description

technical field [0001] The present invention relates to display technology, in particular, to a display panel for a display panel [0002] The manufacturing method of the substrate is shown. Background technique [0003] Organic light-emitting diode (organic light-emitting diode, OLED) devices are currently widely used. Among various OLED devices, manufacturers have shown great interest in flexible OLED devices and produced various flexible OLED devices. [0004] Such as figure 1 As shown, a flexible OLED display panel usually includes multiple films or layers, such as barrier film (barrier film, BF), organic layer (not shown), adhesive layer, thin-film transistor (thin-film transistor, TFT) layer, flexible substrate and substrate. During the fabrication of flexible OLED display panels, laser dicing is typically used to remove portions of one or more films on the substrate, exposing certain components on the substrate for testing. Carbon dioxide lasers have been commonl...

AI Technical Summary

Problems solved by technology

[0006] However, the film on the substrate is usually very thin

Even slightly higher laser energies than required during the cutting process can cause damage to the layers to be exposed (e.g. TFT layers)

As a result, the process window can be relatively narrow using traditional laser cutting techniques

Also, adjusting the laser energy to the proper level can be time consuming and expensive to cut the sample

Furthermore, even if the laser energy level is set at a suitable value, a small fluctuation in energy may cause damage to the layer to be exposed (e.g., TFT layer)

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