Heat dissipation method of semiconductor refrigeration module
A technology of a refrigeration module and a heat dissipation method, which is applied in the directions of refrigerators, refrigeration and liquefaction, and machine operation modes, can solve the problem of high energy consumption of semiconductor refrigeration equipment, and achieve the effect of reducing energy consumption and improving heat dissipation capacity.
Active Publication Date: 2019-02-01
QINGDAO HAIER SPECIAL ICEBOX
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Problems solved by technology
In the prior art, a fan is usually installed directly on the hot end of the semiconductor refrigeration module for air cooling, but in actual use, the fan needs to be in working state all the time, resulting in high energy consumption of the semiconductor refrigeration equipment
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[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0020] Such as Figure 1-Figure 2 As shown, the semiconductor refrigeration equipment in this embodiment includes at least two heat conduction inner tanks 100 spaced apart from each other, each of the heat conduction inner tanks 100 is provided with a semiconductor refrigeration module, and the semiconductor refrigeration module includes a se...
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The invention provides a heat dissipation method for semiconductor refrigeration modules. The multiple semiconductor refrigeration modules are subject to heat dissipation, and a radiator is connected to each semiconductor refrigeration module and comprises a heat conduction body, a plurality of heat pipes, a cooling fin set and a fan; each heat conduction body is connected to the heat end of the corresponding semiconductor refrigeration module, and the heat pipes are connected to the heat conduction bodies; the cooling fin sets are connected to the heat pipes, and auxiliary heat pipes are further connected to the heat conduction bodies; each cooling fin set comprises a plurality of cooling fins, and except for the cooling fins located on the outer sides, gaps are formed in the remaining cooling fins; a plurality of gaps form an auxiliary air way; a cover is further arranged on the outer surface of each cooling fin set, and the auxiliary heat pipe in any radiator is further connected with at least one cooling fin set in the remaining radiators; and the specific heat dissipation method includes the steps thatpart of heat is transferred to the cooling fin sets connected with the heat pipes to be subject to heat dissipation, and the other part of heat is transferred to the cooling fin sets connected to the auxiliary heat pipes to be subject to heat dissipation; and the fans blow air to the cooling fin sets intermittently so as to achieve forced heat dissipation.
Description
technical field [0001] The invention relates to a refrigeration device, in particular to a heat dissipation method for a semiconductor refrigeration module. Background technique [0002] At present, refrigeration equipment (such as refrigerators, freezers, and wine cabinets) is an electrical appliance commonly used in people's daily life. Refrigeration equipment usually has a refrigeration system. Generally, the refrigeration system is composed of a compressor, a condenser, and an evaporator, which can achieve a lower temperature. of refrigeration. However, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for refrigeration is also widely used. The semiconductor refrigeration equipment in the prior art cools the storage space in the cabinet by releasing cold energy from the cold end of the semiconductor refrigeration module, and at the same time, the hot end of the semiconductor refrigeration modu...
Claims
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IPC IPC(8): F25B21/02
Inventor 肖长亮刘越肖曦芦小飞杨末张进刘华
Owner QINGDAO HAIER SPECIAL ICEBOX