34results about How to "Short cooling path" patented technology

A high thermal diffusivity high-power LED street lamp cap with adjustable irradiation angles belongs to the technical field of semiconductor lighting. The LED street lamp cap comprises a lamp cap upper cover, a lamp cap lower cover, a supporting skeleton, a running rest, a lamp cap end closure, a radiator, a light manager, a light penetration panel, a plurality of LED light source drives, a plurality of LED light sources, and an LED breadboard. The lamp cap end closure is fixed on one end of the radiator. The light penetration panel is sealed on the uncovered part of the radiator by glue. The lamp cap upper cover and the lamp cap lower cover are folded, connected and fixed on the other end of the radiator. The radiator is hung on the base plane of the supporting skeleton which is fixed on the running rest. The LED light sources are arranged and encapsulated on the LED circuit board at regular intervals. The LED circuit board is arranged in a sealing space formed by the light lamp end closure, the radiator, the light penetration panel, the light cap upper cover and the like. The back of the LED circuit board is tightly attached to the inner wall of the radiator by a heat-conducting medium. The street lamp cap has good heat dissipation effect, adjustable illumination angle, good service performance and long service life.

The invention discloses a heat dissipation assembly structure which comprises a circuit board, a heat source, a first heat dissipation element, a second heat dissipation element, a first heat dissipation medium and a second dissipation medium, wherein the circuit board is provided with a first main surface, a second main surface and a plurality of through holes, the first main surface and the second main surface are opposite to each other, the heat source is fixed on the first main surface of the circuit board, the first heat dissipation element is arranged on the first main surface of the circuit board and comprises a plurality of first engagement parts, the second heat dissipation element is arranged on the second main surface of the circuit board and comprises a plurality of a second engagement parts, one of each first engagement part and each second bucked part are mutually engaged to form an engagement structure, the engagement structures respectively pass through the through holes of the circuit board, the first heat dissipation medium is arranged between the first heat dissipation element and the heat source, and the second heat dissipation element is arranged between the second heat dissipation element and the circuit board.

The invention discloses an integrated liquid cooling heat sink device of a power module and a bottom plate used by the power module. The integrated liquid cooling heat sink device is connected to the bottoms of a power chip, a copper cladding substrate and the bottom plate of the power module and comprises a square liquid cooling heat sink body, wherein the square liquid cooling heat sink body is fixedly connected to the bottom of the bottom plate, a liquid runner is arranged in the heat sink body and penetrates from left to right, a connection cut is arranged at the top position of the liquid runner, a plurality of staggered turbulence columns are arranged at the bottom of the bottom plate, and the staggered turbulence columns of the bottom plate partially pass through the connection cut and are bucked in the liquid runner. With the integrated liquid cooling heat sink device disclosed by the invention, a heat conductive silicon grease layer with poor heat conductivity is removed, the power module and a heat sink are integratedly designed, the heat sink is the bottom plate of the module, a cooling path is shorter, and the cooling efficiency of the power module is further improved; and moreover, the comprehensive structure of the integrated liquid cooling heat sink device is simplified, and the manufacturing cost is reduced.

The invention discloses a heat-radiation packaging structure and a packaging method which utilize a metal basal plate. The metal basal plate is provided with a plurality of conductive joints, a plurality of insulators, at least one chip, at least one light reflecting mirror and a packaging colloid, wherein the insulators are positioned in the metal basal plate and are arranged between the conductive joints; the chip is installed at the surface of the metal basal plate and is electrically connected with the conductive joints by a plurality of leading wires, and heat energy generated by the chipis dispersed by the metal basal plate; the light reflecting mirror is arranged at the periphery of the metal basal plate and increases the reflection efficiency of a light source; and the packaging colloid covers and protects the metal basal plate. The invention can maintain a favorable heat-radiation effect, simplify the packaging structure and the manufacturing procedure, and lower the production cost.

The invention relates to an LED (Light Emitting Diode) dot matrix display screen which comprises a radiating base, uniformly arrayed LED illuminating units and an imaging controller, wherein layout circuit conductive layers electrically connected with the LED illuminating units are arranged on one side of the radiating base facing to the LED illuminating units; each of the LED illuminating units is independently in electric connection with the imaging controller through each of the layout circuit conductive layers; the LED dot matrix display screen further comprises a runner shell which is arranged on the other side of the radiating base deviating from the LED illuminating units; a radiating through hole is formed in the central position of each four adjacent LED illuminating units; each of the LED illuminating units is adjacent to the radiating through hole; the radiating through hole passes through the radiating base and the runner shell; an outer runner side wall and an inner runner side wall which is arranged on the periphery of the radiating through hole are arranged between the runner shell and the radiating base; and a circulating cooling runner is formed by the runner shell, the outer runner side wall, the inner runner side wall and the radiating base. The LED dot matrix display screen has the advantage of excellent radiating effect.

The invention discloses an LED (light-emitting diode) dot matrix display screen which comprises a heat-dissipating substrate, LED light-emitting units, an imaging controller and a layout circuit conducting layer, wherein the LED light-emitting units are uniformly arrayed; each LED light-emitting unit is separately electrically connected with the imaging controller through the layout circuit conducting layer; the LED light-emitting units are fixed on the heat-dissipating substrate; the central position of every four adjacent LED light-emitting units is provided with a straight heat-dissipating through hole, each LED light-emitting unit is adjacent to the straight heat-dissipating through hole, and the straight heat-dissipating through hole passes through the heat-dissipating substrate; the LED dot matrix display screen also comprises a display-screen outline border, and the display-screen outline border is provided with an accommodating cavity (the bottom surface thereof is provided with an opening); and a position (facing to each LED light-emitting unit) on the front surface of the display-screen outline border is provided with a through hole for covering the LED light-emitting unit, the through hole is provided with a light-pervious seal plate, a position (close to the upside of the display-screen outline border) on the back face of the display-screen outline border is provided with heat-dissipating holes, and the back face of the display-screen outline border is also convexly provided with a rain cover for preventing rainwater from entering the accommodating cavity. The LED dot matrix display screen has the advantages of good heat dissipation and waterproof properties.

The invention discloses a radiating fin structure surface-mount rectifier bridge device. The radiating fin structure surface-mount rectifier bridge device comprises a first diode chip, a second diode chip, a third diode chip, a fourth diode chip and a cathode metal strip all coated by an epoxy packaging body, and a first metal substrate, a second metal substrate and an E-shaped metal substrate are respectively located at left side and right side of the bottom of the epoxy packaging body; a first connecting sheet, a second connecting sheet, a third connecting sheet and a fourth connecting sheet are arranged in parallel along a front-to-back direction; the front end of the cathode metal strip, located between the first metal substrate and the E-shaped metal substrate, comprises a bending part, and the bottom of the bending part and the bottom of each of the first metal substrate, the second meal substrate and the E-shaped metal substrate are in the same horizontal plane and are all naked outside the epoxy packaging body; the first metal substrate and the second metal substrate are used as alternating current input ends, the cathode metal strip is used as a direct current cathode end, and the E-shaped metal substrate is used as a direct current anode end. According to the invention, a radiating path between the chips and a PCB is shortest, radiating fins are metal material and have excellent heat conductivity coefficient, own radiating capacity of the PCB is used fully, and defects of the existing product, such as poor epoxy heat conduction capability caused by radiating through air convection in a case, are avoided.

A high-speed airflow through type air-cooled heat dissipation airborne antenna disclosed by the invention is resistant to a severe environment and high in heat dissipation efficiency. According to the technical scheme, a fairing and a radome define a closed space for protecting an antenna body, and the fairing is in smooth transition connection with the radome through an outer wall ring of a carrier plate; an air inlet area is designed at the front end of the carrier plate along the heading direction, and the antenna body is embedded in the rectangular concave cavity of the carrier plate through a middle rectangular concave cavity and a rear end air exhaust area and is buckled on the upper surface of the concave cavity of the carrier plate to form a heat dissipation functional area; and an antenna body is embedded into the concave cavity of the carrier plate and is provided with strip-shaped heat dissipation teeth along the course, heat generated by the antenna is conducted to the heat dissipation teeth of the antenna, the heat is taken away by blowing airflow generated in the high-altitude flight process of an aerial carrier, and high-speed cold air entering from air inlets in the left side and the right side of the inclined front end of the course converges at the rear end of the air inlet area, flows through the heat dissipation air channel and is discharged from the air outlet, and the air directly blows the surfaces of the heat dissipation teeth to discharge the heat dissipated by the antenna to the atmosphere.

The invention provides a self-cooling semiconductor laser, which overcomes the problems of long heat transfer path, large thermal resistance, large volume and the like of a laser semiconductor adopting an existing heat dissipation structural form. The self-cooling semiconductor laser comprises a semiconductor laser working area and a substrate, wherein the semiconductor laser working area grows on the substrate, and the substrate is divided into a first substrate and a second substrate which are stacked up and down; the upper surface of the first substrate is in contact with the semiconductor laser working area and is a current diffusion flow-through area; a cooling flow channel is formed in the second substrate and is used for cooling the semiconductor laser working area; heat generated by the semiconductor laser working area is conducted to the second substrate through the first substrate and exchanges heat with a refrigerant flowing in the cooling flow channel in the second substrate, so that the path between a hot spot and the refrigerant is shortened, the thermal resistance is reduced, and the purpose of improving the overall heat exchange effect is achieved; and meanwhile, an external cooling heat sink is not needed, the overall size of the device is reduced, and integrated design is facilitated.

The invention discloses an LED base plate with high power and high heat dissipation efficiency. The LED base plate comprise an LED light emitting chip, a circuit board, a rubber insulating layer and aheat dissipation device. The LED base plate is characterized in that the circuit board and the rubber insulating layer are directly solidified on the installation end surface of the heat dissipationdevice, namely the rubber insulating layer is arranged on the installation end surface of the heat dissipation device, the circuit board is arranged on the rubber insulating layer, and the LED light emitting chip is arranged in the circuit board. The LED light emitting chip, the circuit board and the rubber insulating layer are directly solidified on the installation end surface of the heat dissipation device, compared with a traditional structure, and the structure omits the structure of a base plate body and only has a two-layer structure; and no gap exists between the rubber insulating layer and the installation end surface of the heat dissipation device, so that an air layer cannot be formed; a heat dissipation path is short, so that the heat dissipation effect is greatly improved, theluminous efficiency of the LED light-emitting chip is improved, the light attenuation is small, the heat conduction and heat convection of the LED photoelectric base plate are enhanced, the defect ofexcessively high junction temperature of an LED is thoroughly overcome, and the service life of an LED light source is prolonged.

The invention aims to provide a battery shell manufacturing method, a battery shell and a battery. The battery shell manufacturing method comprises: S1, coating a layer of ink pattern on a metal plate, and coating solder on a non-graphite pattern area; S2, stacking at least one layer of metal plate on the metal plate, and performing hot rolling to form a composite plate; S3, filling high-pressure fluid along a non-compounded part of the graphite pattern to expand the pipeline, filling a heat transfer working medium into part of the pipeline, and sealing the pipeline; S4, performing bending to form a U shape, adding a bottom plate, and conducting fixed connection to form a metal piece with a cavity; and S5, installing end plates at the two ends of the metal piece. According to the battery shell manufacturing method, the soaking capacity and the heat dissipation capacity of the battery shell are greatly improved, the heat dissipation path is short, the heat dissipation efficiency is improved, the heat dissipation cost is reduced, and the requirement for efficient heat control of the electric core level is met.

The invention discloses a highly efficient heat dissipation motor rotor structure. The structure comprises a rotor and a spindle arranged in the center of the rotor. Multiple rotor heat dissipation wind flow channels are arranged in the rotor. Rotor wind covers are arranged on two ends of the rotor. Air passing flow channel are arranged between the rotor wind covers and the spindle. The air passing flow channels between the rotor wind covers and the spindle and the rotor heat dissipation wind flow channels in the rotor form rotor heat dissipation wind channels. According to the invention, energy is saved; consumption is reduced;, heat is highly efficiently radiated; the structure is simple; and service lifetime of the motor can be prolonged.

The invention aims to provide a manufacturing method of a battery shell, the battery shell and a battery. The manufacturing method of the battery shell comprises the following steps that S1, a metal blank is manufactured into a tubular prefabricated metal part through hot extrusion or cold extrusion; s2, the outer side face of the prefabricated metal part is coated with a layer of ink pattern, and a non-graphite pattern area is coated with welding flux; s3, a layer of metal plate is stacked on the side face of the prefabricated metal part, and a composite board is formed through hot rolling; s4, high-pressure fluid is injected along the non-compounded part of a graphite pattern to expand the pipeline, a heat transfer working medium is injected into the pipeline, and the pipeline is sealed; and S5, end plates are installed at the two ends of the prefabricated metal part. According to the manufacturing method of the battery shell, the soaking capacity and the heat dissipation capacity of the battery shell are greatly improved, the heat dissipation path is short, the heat dissipation efficiency is improved, the heat dissipation cost is reduced, and the requirement for efficient heat control of the electric core level is met.

The invention provides a QFN (Quad Flat No-leadPackage) surface mounted RGB-LED packaging support, which comprises a metal bottom plate and an insulating frame, and is characterized in that the obverse side of the metal bottom plate is provided with light emitting areas, each light emitting area is divided into four regions, the regions are connected by the insulating frame, the insulating frame forms bowls at the obverse side of the metal bottom plate, and the reverse side of the metal bottom plate is provided with bonding pads used for being connected with an external circuit. The invention further provides a manufacturing method of the packaging support, which comprises the steps of making the metal bottom plate into a conductive circuit, manufacturing bonding pads at the reverse side of the metal bottom plate, manufacturing steps at the obverse side and/or the reverse side of the metal bottom plate, wrapping the metal bottom plate with rubber, leaving out metal electrodes for die bonding and wire welding, and forming a bowl-shaped insulating frame. According to the invention, light is concentrated through the bowl structure, the light emitting surface is enabled to be unique, and thus a manufactured display screen is enabled to be more excellent in resolution; and the tightness in combination with the insulating frame and the stability of the packaging support are ensured through manufacturing the steps on the metal bottom plate.