QFN (Quad Flat No-leadPackage) surface mounted RGB-LED packaging support and manufacturing method thereof

A technology of RGB-LED and packaging support, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, and electric solid-state devices. Excellent contrast ratio and the effect of improving productivity

Pending Publication Date: 2017-08-04
SHANDONG JIERUNHONG OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a QFN surface-mounted RGB LED packaging bracket and its manufacturing method, aiming to solve the existing SMD RGB LED light dispersion serious, poor packaging mechanical strength, poor sealing, poor heat dissipation and other problems

Method used

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  • QFN (Quad Flat No-leadPackage) surface mounted RGB-LED packaging support and manufacturing method thereof
  • QFN (Quad Flat No-leadPackage) surface mounted RGB-LED packaging support and manufacturing method thereof
  • QFN (Quad Flat No-leadPackage) surface mounted RGB-LED packaging support and manufacturing method thereof

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Embodiment Construction

[0031] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0032] figure 1 It is a schematic diagram of the structure of the existing PPA+copper pin package bracket. Since this type of package bracket uses the injection molding machine to attach the thermoplastic material to the metal, there is no sticking together. When thermal expansion and cold contraction, it is easy to A gap is generated, and when the end customer is using it, external water and water vapor can easily enter the package through the gap, causing product failure. figure 2 It is a schematic diagram of the structure of the existing CHIP type packaging bracket. It is formed by surrounding and compacting the glass fiber with resin 801, and then dipping copper and platinum etching lines. The gap and moisture absorption rate of the...

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Abstract

The invention provides a QFN (Quad Flat No-leadPackage) surface mounted RGB-LED packaging support, which comprises a metal bottom plate and an insulating frame, and is characterized in that the obverse side of the metal bottom plate is provided with light emitting areas, each light emitting area is divided into four regions, the regions are connected by the insulating frame, the insulating frame forms bowls at the obverse side of the metal bottom plate, and the reverse side of the metal bottom plate is provided with bonding pads used for being connected with an external circuit. The invention further provides a manufacturing method of the packaging support, which comprises the steps of making the metal bottom plate into a conductive circuit, manufacturing bonding pads at the reverse side of the metal bottom plate, manufacturing steps at the obverse side and/or the reverse side of the metal bottom plate, wrapping the metal bottom plate with rubber, leaving out metal electrodes for die bonding and wire welding, and forming a bowl-shaped insulating frame. According to the invention, light is concentrated through the bowl structure, the light emitting surface is enabled to be unique, and thus a manufactured display screen is enabled to be more excellent in resolution; and the tightness in combination with the insulating frame and the stability of the packaging support are ensured through manufacturing the steps on the metal bottom plate.

Description

technical field [0001] The present invention relates to SMD (Surface Mounted Devices, surface mount device) LED packaging technology, in particular to QFN (Quad Flat No-lead Package, square flat no-lead package) surface mount RGB LED packaging bracket and its manufacturing method. Background technique [0002] With the continuous development of the display industry, LEDs for display screens have changed from the original DIP (dual inline-pinpackage) structure to the SMD structure at a high speed. The advantages of installation, large luminous angle, uniform color, and reduced attenuation are more and more accepted by people. Although general SMD LEDs have the above advantages, they still have large attenuation, long heat conduction paths, low carrying current, complex production, and low reliability. Low moisture resistance and poor weather resistance; if the reliability of the product is to be improved without changing the overall structure of the product, there is still no...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/48H01L33/64H01L25/075H01L21/48
CPCH01L25/0753H01L33/48H01L33/62H01L33/647H01L21/4821
Inventor 李邵立孔一平袁信成
Owner SHANDONG JIERUNHONG OPTOELECTRONICS CO LTD
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