QFN (Quad Flat No-leadPackage) surface mounted RGB-LED packaging support and manufacturing method thereof
A technology of RGB-LED and packaging support, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, and electric solid-state devices. Excellent contrast ratio and the effect of improving productivity
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[0031] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples.
[0032] figure 1 It is a schematic diagram of the structure of the existing PPA+copper pin package bracket. Since this type of package bracket uses the injection molding machine to attach the thermoplastic material to the metal, there is no sticking together. When thermal expansion and cold contraction, it is easy to A gap is generated, and when the end customer is using it, external water and water vapor can easily enter the package through the gap, causing product failure. figure 2 It is a schematic diagram of the structure of the existing CHIP type packaging bracket. It is formed by surrounding and compacting the glass fiber with resin 801, and then dipping copper and platinum etching lines. The gap and moisture absorption rate of the...
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