Heat-radiation packaging structure and packaging method

A technology of packaging structure and packaging method, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of high heat dissipation and high density of semiconductors, limited heat conduction efficiency, and imperfect heat dissipation effect.
CN101685808AInactive Publication Date: 2010-03-31何昆耀
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
何昆耀
Publication Date
2010-03-31
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a heat-radiation packaging structure and a packaging method which utilize a metal basal plate. The metal basal plate is provided with a plurality of conductive joints, a plurality of insulators, at least one chip, at least one light reflecting mirror and a packaging colloid, wherein the insulators are positioned in the metal basal plate and are arranged between the conductive joints; the chip is installed at the surface of the metal basal plate and is electrically connected with the conductive joints by a plurality of leading wires, and heat energy generated by the chipis dispersed by the metal basal plate; the light reflecting mirror is arranged at the periphery of the metal basal plate and increases the reflection efficiency of a light source; and the packaging colloid covers and protects the metal basal plate. The invention can maintain a favorable heat-radiation effect, simplify the packaging structure and the manufacturing procedure, and lower the production cost.
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Description

【Technical field】

[0001] The invention relates to a semiconductor packaging technology, in particular to a heat dissipation packaging structure and a packaging method. 【Background technique】

[0002] In the early heat dissipation packaging structure, the copper foil printed circuit board was directly used as the heat dissipation medium, and the FR4 printed circuit board was most commonly used. However, as the component density becomes higher and higher, the speed requirements become faster and the power consumption of the assembled components is higher and higher, the heat energy will increase more and more, because the thermal conductivity of the FR4 printed circuit board is insufficient , so that it is gradually difficult to meet the heat dissipation requirements.

[0003] Therefore, another metal core printed circuit board (Metal Core PCB, MCPCB) packaging structure that can effectively improve the heat dissipation problem has been proposed, such as figure 1 As shown, t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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