59results about How to "Make full use of cooling capacity" patented technology

An electronic apparatus, such as, personal computers of so-called a desktop type and a notebook type, as well as, a server, etc., having a cooling system being high in cooling efficiency, wherein a CPU 200 in need of cooling is installed within a hosing 100, and the liquid cooling system for cooling the CPU, comprises: a heat-receiving (cooling) jacket 50; a radiator 60; and a circulation pump 70, wherein the heat-receiving (cooling) jacket 50, for transmitting heat generated from a heat-generation element, i.e., the CPU, into a liquid coolant flowing with in an inside thereof, has a heat diffusion plate 90 attached on the lower surface thereof. This heat diffusion plate encloses an operating fluid 94, such as water, within a space, which is hermetically sealed and formed within an inside thereof, and also has heater elements 95, being provided in contact with a portion the operating fluid. To those heater elements 95 are supplied a pulse-like electric power. With this, a portion of the operating fluid repeats forming / extinguishing, to give vibration to the operating fluid, thereby diffusing the heat over the entire of the diffusion plate, as a whole, thereafter the heat is transmitted to the heat-receiving (cooling) jacket. Or, alternatively, it may be connected with a heat radiation fin 300.

Provided is a power module packaging structure with a water-cooled heat sink used for two-sided cooling. The power module packaging structure comprises the tabular water-cooled heat sink with a water inlet and a water outlet. Power device units are packaged on the upper surface of the water-cooled heat sink and the lower surface of the water-cooled heat sink, a power terminal located on the surface of a shell is made into a shape by which a nut can be fixed conveniently, and a signal terminal located on the surface of the shell is specially made into a shape which has good welding performance and facilitates fixing and clamping of a PCB. The water-cooled heat sink is fixedly connected with insulating substrates of the power device units directly or through a cushioning material layer, and the power terminal and the signal terminal are directly welded to surface metal layers of the insulating substrates in an ultrasonic welding mode. The shell is fixedly connected with the heat sink, and the signal terminal and the power terminal are directly fixed onto the shell in an injection molding mode. The power module packaging structure has the advantages of being reasonable in structure and convenient to use and install, making full use of the cooling capacity of the water-cooled heat sink, obtaining maximum power density and the like.

The invention relates to a method for determining surface temperature change of a radiation plate of a radiation cold supply system in water supply cooling. The method comprises the following steps: influence factors of the surface temperature change of the radiation plate and change ranges of all factors are determined according to actual operation conditions of a radiation cold supply air conditioning system; according to the determined influence factors of the surface temperature change rules of the radiation plate and the change ranges of all the factors, ANSYS software is applied to simulate the surface temperature change conditions of the radiation plate in water supply cooling under different influence factors to obtain sample data; and based on SAS software, a statistic analysis program is applied to perform regression analysis for the sample data to obtain a surface temperature change prediction model of the radiation plate in water supply cooling. The method is higher in accuracy of the prediction result obtained by the regression analysis, is simple in control system, can realize real-time control, and is suitable for residential building heating system control.

The invention provides an energy-saving and environment-friendly method for preparing ethylbenzene from dry gas. The method is mainly used for gas-liquid separation and tail gas debenzolization of a reaction product of preparing ethylbenzene from dry gas. The method is characterized in that gas-liquid separation and tail gas absorption of a reaction product of ethylbenzene preparation from dry gasare carried out in a same tower, an absorption and separation tower is divided into four sections, a tower upper section is a packing section, a tower middle section is a tube nest cooling section, atower lower section is a plate type tower, and a tower bottom section is a tower kettle. The reaction product enters from the upper part of the tower kettle and an absorbent enters from the top of the packing section; after the tail gas is absorbed and separated by the absorption and separation tower, the tail gas enters a fuel gas pipe network from the tower top, and rich absorption liquid is mixed with condensed liquid in the reaction product and flows out from the bottom of the tower kettle to enter a benzene tower. Non-condensable gas at the top of the benzene tower returns to the absorption and separation tower, circulating benzene 1 is extracted from the upper section of the benzene tower and enters an alkylation reactor, circulating benzene 2 at the bottom of a benzene tower refluxtank enters an alkyl transfer reactor, materials at the bottom of the benzene tower enter an ethylbenzene tower to obtain a product ethylbenzene at the top of the ethylbenzene tower, and tower bottomliquid of the ethylbenzene tower is divided into three parts, one stream returns to the absorption and separation tower as an absorbent, one stream is sent to the transalkylation reactor, and the other stream is aromatic hydrocarbon oil. The separation process is simple and reliable, tower equipment is reduced while reaction heat is fully utilized, equipment investment and subsequent operation cost are saved, and energy consumption of the device is reduced. According to the separation method, the recovery rate of benzene carried by the tail gas is greater than 99.9%, and the purity of an ethylbenzene product is greater than 99.8%.

The invention provides a gradient utilization device of a line focusing concentrating photovoltaic-photothermal full spectrum. Compared with the traditional concentrating photovoltaic technology, the device has the advantages that an upper layer collecting lens is provided, as only sunlight within an operating wavelength range of a concentrating photovoltaic battery but not all sunlight is subjected to photovoltaic utilization, the heat yield of the photovoltaic battery is reduced, and meanwhile the photoelectric conversion efficiency of the photovoltaic battery is enhanced; through medium temperature photothermal utilization, the photovoltaic-photothermal utilization grade is enhanced, so that the solar radiation utilization ratio is improved, full spectrum utilization of solar energy is realized, and irreversible loss during solar utilization is reduced.

The invention provides a refrigerating device. The refrigerating device comprises a case body, an air-adjusted film assembly, an oxygen exhausting pipeline and a gas pumping device. Storage space and a compressor room are arranged in the case body in limited modes, a storage container is arranged in the storage space, and air-adjusted freshness retaining space is arranged in the storage container. The air-adjusted film assembly is configured in a mode that compared with nitrogen in peripheral space airflow of the air-adjusted film assembly, and more oxygen in the peripheral space airflow of the air-adjusted film assembly penetrates an air-adjusted film and enters an enriched oxygen collecting cavity. An inlet of the oxygen exhausting pipeline communicates with the oxygen-rich gas collecting cavity, and an outlet of the oxygen exhausting pipeline is towards a condenser so as to enable gas flowing out of the oxygen-rich gas collecting cavity to blow towards the condenser. The gas pumping device is arranged on the oxygen exhausting pipeline, so that the gas penetrated into the oxygen-rich gas collecting cavity is pumped and exhausted outside the storage container. According to the refrigerating device, not only is the freshness retaining effect good, but also cold energy in the gas flowing out of the oxygen-rich gas collecting cavity is fully utilized so as to conduct cooling on the condenser, and the energy efficiency of the refrigerating device is improved.

The invention relates to the field of refrigeration process of boost expanders, in particular to a hot start method for a boost expander, wherein the method is characterized in that in a hot start initial stage, all gases exhausted from an expansion end enter a waste nitrogen channel of a main heat exchanger to bypass and quicken decrease of temperature of the main heat exchanger, simultaneously, air exhausted from a cold end of the main heat exchanger flows into the expansion end at the first, then air in the middle of the main heat exchanger gradually flows into the expansion end after the temperature of the air exhausted from the expansion end is reduced to a designed value to enable the expander to run at the highest secure rotation speed all the time, and to fully develop maximum refrigerating capacity to shorten space division hot start time. Compared with the prior art, beneficial effects of the method are as follows: after the method is utilized, hot start time of the expander is shortened from former 48 h to 42 h, a bypass operation period is crossed fast in relatively shorter time, and refrigerating capacity of the expander is fully developed to further reduce power consumption for start.

The invention relates to a high-reliability rectifier bridge device. The device comprises a first diode chip, a second diode chip, a third diode chip, a fourth diode chip and a negative pole metal strip which are wrapped by an epoxy packaging body; a first connecting sheet, a second connecting sheet, a third connecting sheet and a fourth connecting sheet are parallelly disposed in a front-rear direction; the front end of the negative pole metal strip, which is located between a first metal substrate and an E-shaped metal substrate, is provided with a bent portion; the bottom of the bent portion and the bottoms of the first metal substrate, a second first metal substrate and the E-shaped metal substrate are located on the same horizontal plane and all protrude out of the epoxy packaging body; the first metal substrate and the second metal substrate serve as alternating current input ends; the bent portion of the negative pole metal strips serves as a direct-current negative pole end; and the E-shaped metal substrate serves as a direct-current positive pole end. According to the high-reliability rectifier bridge device of the invention, a heat dissipation path between a chip and a PCB is the shortest; being made of a metal material, the heat dissipation sheets have optimal heat conductivity; and the heat dissipation capability of the PCB itself is fully utilized.

The invention discloses a parallel operation system of cooling towers with different areas. The parallel operation system of the cooling towers with the different areas is characterized in that a first cooling tower and a second cooling tower are together arranged in the system, and the cooling area of the first cooling tower is less than the cooling area of the second cooling tower. According to the parallel operation system of the cooling towers with the different areas, a coil pipe resistance piece is arranged so that the cooling towers with the different areas are enabled to be put under an associated operating state, cooling capacity of the cooling towers which are originally needed to be wasted is fully used, and therefore construction investment of a newly-built power plant is saved.

The invention provides a cooling device and semiconductor refrigeration equipment. The cooling device comprises a plurality of radiators. Each radiator comprises a heat conductor, a plurality of heat pipes, a cooling fin set and a fan, wherein the heat pipes are connected to the heat conductor, the cooling fin set is connected to the heat pipes, and the fan and the cooling fin set are arranged side by side. An auxiliary heat pipe is further connected to each heat conductor, and the auxiliary heat pipe in any radiator is further connected with at least one cooling fin set in the rest of the radiators. Heat at the heat ends of semiconductor refrigeration modules is absorbed by means of the heat conductors, the heat conductors can transmit the heat to the cooling fin sets with large cooling areas through the heat pipes for automatic cooling, and the requirement for powering on the fans all the time for air cooling is avoided; and in addition, the heat conductors can conduct cooling by utilizing the cooling fin sets in the multiple radiators at the same time, so that the multiple cooling fin sets are in the cooling state all the time, and accordingly the cooling capacity of the multiple cooling fin sets is brought into full play, the cooling capacity of the semiconductor refrigeration equipment is improved, and energy consumption of the semiconductor refrigeration equipment is reduced.

The invention relates to a miniature bridge rectifier. According to the miniature bridge rectifier, a first metal substrate, a second metal substrate and an E-shaped metal substrate are located at thebottom of an epoxy packaging body and are distributed at the left side and right side of the epoxy packaging body; a negative pole metal strip is located between the first metal substrate, the secondmetal substrate and the E-shaped metal substrate; two ends of a first connecting sheet are electrically connected with the negative pole end of a first diode chip and the upper surface of the negative pole metal strip respectively; and the middle portion of a second connecting sheet is provided with a protruding portion which is isolated from the negative pole metal strip through the epoxy packaging body; a second positioning mechanism is composed of protruding points at two sides of the first metal substrate and two sides of the second metal substrate, and recessed portions at two sides of the tail end of the second connecting sheet and two sides of the tail end of a fourth connecting sheet, wherein the protruding points are embedded into the recessed portions; the thickness of the epoxypackaging body is smaller than 2 mm; and an end surface of the E-shaped metal substrate, which is located at the edge of the epoxy packaging body, is provided with four second pin outward-protrudingportions. An existing product dissipates heat through air convection in a chassis, as a result, the area of heat dissipation sheets can be 50% of the length*width area of the product, while, with theminiature bridge rectifier adopted, such kind of situation in the prior art can be avoided.