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66results about How to "Maximize Cooling Efficiency" patented technology

Method and apparatus for evaporative cooling of a cooling fluid

A method and an apparatus of evaporative cooling for reducing the volume of an evaporative cooler by considerably lowering the temperature of a cooling fluid are disclosed. A first cooling fluid, which comprises most part of the cooling fluid evaporatively cooled by an outside air while passing through an evaporative cooling section after circulating in an apparatus to be cooled, re-circulates in the apparatus to be cooled. A second cooling fluid, which is separated from the cooling fluid after being cooled in the evaporative cooling section, passes through a sensible air-cooling section placed at an outside air inlet. Thereby, the inflow outside air is sensibly cooled. The second cooling fluid, which passes through the sensible cooling section, re-circulates in the evaporative cooling section. Also, the outside air that is sensibly cooled by the second cooling fluid evaporatively cools the cooling fluid, which passes through the evaporative cooling section, again. This process is repeated. Accordingly, the cooling efficiency in the apparatus to be cooled becomes maximized. The second cooling fluid indirectly contacts with the outside air, so the outside air is sensibly cooled without increasing its humidity. Thus, the wet-bulb temperature of the air inhaled into the evaporative cooling section is reduced and the cooling fluid can be cooled to even a lower temperature. Also, the above structure can provide a cooling fluid of even a lower temperature, so the volume of a cooling tower or outdoor unit, etc. can be reduced considerably.
Owner:WHIZEN GLOBAL

Power module packaging structure with water-cooled heat sink used for two-sided cooling

Provided is a power module packaging structure with a water-cooled heat sink used for two-sided cooling. The power module packaging structure comprises the tabular water-cooled heat sink with a water inlet and a water outlet. Power device units are packaged on the upper surface of the water-cooled heat sink and the lower surface of the water-cooled heat sink, a power terminal located on the surface of a shell is made into a shape by which a nut can be fixed conveniently, and a signal terminal located on the surface of the shell is specially made into a shape which has good welding performance and facilitates fixing and clamping of a PCB. The water-cooled heat sink is fixedly connected with insulating substrates of the power device units directly or through a cushioning material layer, and the power terminal and the signal terminal are directly welded to surface metal layers of the insulating substrates in an ultrasonic welding mode. The shell is fixedly connected with the heat sink, and the signal terminal and the power terminal are directly fixed onto the shell in an injection molding mode. The power module packaging structure has the advantages of being reasonable in structure and convenient to use and install, making full use of the cooling capacity of the water-cooled heat sink, obtaining maximum power density and the like.
Owner:嘉兴斯达微电子有限公司
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