Provided is a
power module packaging structure with a water-cooled
heat sink used for two-sided cooling. The
power module packaging structure comprises the tabular water-cooled
heat sink with a water inlet and a water outlet. Power device units are packaged on the upper surface of the water-cooled
heat sink and the lower surface of the water-cooled heat sink, a power terminal located on the surface of a shell is made into a shape by which a nut can be fixed conveniently, and a
signal terminal located on the surface of the shell is specially made into a shape which has good
welding performance and facilitates fixing and clamping of a PCB. The water-cooled heat sink is fixedly connected with insulating substrates of the power device units directly or through a
cushioning material layer, and the power terminal and the
signal terminal are directly welded to surface
metal layers of the insulating substrates in an
ultrasonic welding mode. The shell is fixedly connected with the heat sink, and the
signal terminal and the power terminal are directly fixed onto the shell in an injection molding mode. The
power module packaging structure has the advantages of being reasonable in structure and convenient to use and install, making full use of the
cooling capacity of the water-cooled heat sink, obtaining
maximum power density and the like.