Power module packaging structure with water-cooled heat sink used for two-sided cooling
A water-cooled radiator and module power technology, which is applied to electric solid devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of compactness and reasonable layout of the engine compartment, occupying power input lines, etc., to maximize Power Density, Reduced Package Additional Devices, Reasonable Structure
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[0019] The present invention optimizes the design of the power module integrated package for double-sided heat dissipation of the water-cooled radiator, realizes the optimization of the water-cooling heat dissipation capacity and the package with the maximum power density, and has great significance for high power density applications.
[0020] Such as figure 1 As shown, the integrated packaging of the power module with double-sided heat dissipation of the water-cooled radiator has a single water-cooled radiator 5, and power device units 1 and 8 directly packaged on the upper and lower surfaces. The upper and lower surfaces of the water-cooled radiator are respectively Two power device units dissipate heat to optimize heat dissipation. The water inlet 6 and the water outlet 7 of the water-cooled radiator are respectively located at the left and right ends of the water-cooled heat dissipation, and their positions are optimized and adjusted according to the distribution position...
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