Power module packaging structure with water-cooled heat sink used for two-sided cooling

A water-cooled radiator and module power technology, which is applied to electric solid devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of compactness and reasonable layout of the engine compartment, occupying power input lines, etc., to maximize Power Density, Reduced Package Additional Devices, Reasonable Structure

Inactive Publication Date: 2014-05-07
嘉兴斯达微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the structure of the car engine compartment also requires the package of power devices to have a miniaturized terminal design layout, otherwise, it will take up a lot of extra space to configure the driver, power inlet, etc., which brings difficulties to the compactness and rational layout of the engine compartment

Method used

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  • Power module packaging structure with water-cooled heat sink used for two-sided cooling
  • Power module packaging structure with water-cooled heat sink used for two-sided cooling
  • Power module packaging structure with water-cooled heat sink used for two-sided cooling

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Embodiment

[0019] The present invention optimizes the design of the power module integrated package for double-sided heat dissipation of the water-cooled radiator, realizes the optimization of the water-cooling heat dissipation capacity and the package with the maximum power density, and has great significance for high power density applications.

[0020] Such as figure 1 As shown, the integrated packaging of the power module with double-sided heat dissipation of the water-cooled radiator has a single water-cooled radiator 5, and power device units 1 and 8 directly packaged on the upper and lower surfaces. The upper and lower surfaces of the water-cooled radiator are respectively Two power device units dissipate heat to optimize heat dissipation. The water inlet 6 and the water outlet 7 of the water-cooled radiator are respectively located at the left and right ends of the water-cooled heat dissipation, and their positions are optimized and adjusted according to the distribution position...

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Abstract

Provided is a power module packaging structure with a water-cooled heat sink used for two-sided cooling. The power module packaging structure comprises the tabular water-cooled heat sink with a water inlet and a water outlet. Power device units are packaged on the upper surface of the water-cooled heat sink and the lower surface of the water-cooled heat sink, a power terminal located on the surface of a shell is made into a shape by which a nut can be fixed conveniently, and a signal terminal located on the surface of the shell is specially made into a shape which has good welding performance and facilitates fixing and clamping of a PCB. The water-cooled heat sink is fixedly connected with insulating substrates of the power device units directly or through a cushioning material layer, and the power terminal and the signal terminal are directly welded to surface metal layers of the insulating substrates in an ultrasonic welding mode. The shell is fixedly connected with the heat sink, and the signal terminal and the power terminal are directly fixed onto the shell in an injection molding mode. The power module packaging structure has the advantages of being reasonable in structure and convenient to use and install, making full use of the cooling capacity of the water-cooled heat sink, obtaining maximum power density and the like.

Description

technical field [0001] The invention relates to a module power packaging structure using double-sided heat dissipation of a water-cooled radiator, and belongs to the technical field of electric vehicle power module packaging. Background technique [0002] In the 21st century, the impact of automobiles on human beings has become more and more enormous, and the conflict between its pros and cons has become increasingly apparent. On the one hand, automobiles bring convenient, fast, reliable and stable performance, bring great convenience to human life, and are also changing the way of life of human beings. On the other hand, the seriousness of air pollution caused by traditional vehicles driven by fuel has gradually attracted human attention, and the fluctuation and continuous rise of international oil prices have also led to an increase in the cost of using vehicles. Therefore, the development of electric vehicles has attracted more and more people's attention and thinking. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473
CPCH01L2924/0002H01L2924/00
Inventor 刘志宏
Owner 嘉兴斯达微电子有限公司
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