Cooling system for electronic apparatus, and electronic apparatus using the same

Abstract

An electronic apparatus, such as, personal computers of so-called a desktop type and a notebook type, as well as, a server, etc., having a cooling system being high in cooling efficiency, wherein a CPU 200 in need of cooling is installed within a hosing 100, and the liquid cooling system for cooling the CPU, comprises: a heat-receiving (cooling) jacket 50; a radiator 60; and a circulation pump 70, wherein the heat-receiving (cooling) jacket 50, for transmitting heat generated from a heat-generation element, i.e., the CPU, into a liquid coolant flowing with in an inside thereof, has a heat diffusion plate 90 attached on the lower surface thereof. This heat diffusion plate encloses an operating fluid 94, such as water, within a space, which is hermetically sealed and formed within an inside thereof, and also has heater elements 95, being provided in contact with a portion the operating fluid. To those heater elements 95 are supplied a pulse-like electric power. With this, a portion of the operating fluid repeats forming / extinguishing, to give vibration to the operating fluid, thereby diffusing the heat over the entire of the diffusion plate, as a whole, thereafter the heat is transmitted to the heat-receiving (cooling) jacket. Or, alternatively, it may be connected with a heat radiation fin 300.

Description

technical field [0001] The present invention relates to electronic equipment such as desktop or notebook personal computers or servers, and more particularly to a cooling system for electronic equipment capable of efficiently cooling semiconductor integrated circuit elements mounted therein as heat-generating elements, and methods using the same. Electronic equipment. Background technique [0002] Semiconductor integrated circuit elements as heat generating elements in electronic equipment such as desktop or notebook personal computers or servers, especially heat generating elements represented by CPU (Central Processing Unit) usually need to be cooled in order to ensure their normal operation. For this reason, conventionally, the cooling has been realized by using a heat transfer body integrally formed with fins called fins and a fan for blowing cooling air thereto. However, in recent years, the continuous miniaturization and high integration of semiconductor integrated ci...

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