Cooling system for electronic apparatus, and electronic apparatus using the same

Abstract

An electronic apparatus, such as, personal computers of so-called a desktop type and a notebook type, as well as, a server, etc., having a cooling system being high in cooling efficiency, wherein a CPU 200 in need of cooling is installed within a hosing 100, and the liquid cooling system for cooling the CPU, comprises: a heat-receiving (cooling) jacket 50; a radiator 60; and a circulation pump 70, wherein the heat-receiving (cooling) jacket 50, for transmitting heat generated from a heat-generation element, i.e., the CPU, into a liquid coolant flowing with in an inside thereof, has a heat diffusion plate 90 attached on the lower surface thereof. This heat diffusion plate encloses an operating fluid 94, such as water, within a space, which is hermetically sealed and formed within an inside thereof, and also has heater elements 95, being provided in contact with a portion the operating fluid. To those heater elements 95 are supplied a pulse-like electric power. With this, a portion of the operating fluid repeats forming / extinguishing, to give vibration to the operating fluid, thereby diffusing the heat over the entire of the diffusion plate, as a whole, thereafter the heat is transmitted to the heat-receiving (cooling) jacket. Or, alternatively, it may be connected with a heat radiation fin 300.

Description

technical field [0001] The present invention relates to electronic equipment such as desktop or notebook personal computers or servers, and more particularly to a cooling system for electronic equipment capable of efficiently cooling semiconductor integrated circuit elements mounted therein as heat-generating elements, and methods using the same. Electronic equipment. Background technique [0002] Semiconductor integrated circuit elements as heat generating elements in electronic equipment such as desktop or notebook personal computers or servers, especially heat generating elements represented by CPU (Central Processing Unit) usually need to be cooled in order to ensure their normal operation. For this reason, conventionally, the cooling has been realized by using a heat transfer body integrally formed with fins called fins and a fan for blowing cooling air thereto. However, in recent years, the continuous miniaturization and high integration of semiconductor integrated ci...

AI Technical Summary

Problems solved by technology

[0016] In such a case where the area of ​​the CPU as a heat generating element in contact with the heat-absorbing (cooling) jacket is very small, the heat generated in the CPU diffuses to the contact surface with the above-mentioned heat-absorbing (cooling) jacket and its peripheral portion, and then transfers to the heat-absorbing (cooling) jacket. The liquid refrigerant flowing in the jacket is discharged to the outside, but when the contact area is small, even if the heat is discharged to the periphery to some extent, it does not spread to the whole jacket. Therefore, the heat-absorbing (cooling) jacket is Decreased cooling efficiency of heating elements

That is, at a position far away from the contact position with the CPU, the transfer of heat to the liquid refrigerant flowing in the jacket cannot be sufficiently performed. Therefore, the cooling capacity of the heat-absorbing (cooling) jacket cannot be fully utilized, and only its Part of ability

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