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QFN surface-mounted RGB-LED encapsulation module and manufacturing method thereof

A technology of RGB-LED and manufacturing method, which is applied in the direction of identification devices, instruments, semiconductor devices, etc., can solve the problems of poor mechanical strength of the package body and low production efficiency of single placement, and achieves enhanced electrical conductivity and improved resistance to external machinery. Intensity ability, the effect of avoiding color difference

Pending Publication Date: 2017-06-13
SHANDONG JIERUNHONG OPTOELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a QFN surface-mounted RGB LED packaging module and its manufacturing method, aiming to solve the problems of low production efficiency and poor mechanical strength of the package body in the existing surface-mounted RGB LEDs.

Method used

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  • QFN surface-mounted RGB-LED encapsulation module and manufacturing method thereof
  • QFN surface-mounted RGB-LED encapsulation module and manufacturing method thereof
  • QFN surface-mounted RGB-LED encapsulation module and manufacturing method thereof

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Embodiment Construction

[0038] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0039] figure 1 It is a schematic diagram of the structure of the existing PPA+copper pin package bracket. Since this type of package bracket uses the injection molding machine to attach the thermoplastic material to the metal, there is no sticking together. When thermal expansion and cold contraction, it is easy to A gap is generated, and when the end customer is using it, external water and water vapor can easily enter the package through the gap, causing product failure. figure 2 It is a schematic diagram of the structure of the existing CHIP type packaging bracket. It is formed by surrounding and compacting the glass fiber with resin 801, and then dipping copper and platinum etching lines. The gap and moisture absorption rate of the...

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Abstract

The invention provides a QFN surface-mounted RGB-LED encapsulation module and a manufacturing method thereof. The RGB-LED encapsulation module comprises an encapsulation bracket and light-emitting units arranged on the encapsulation bracket, wherein the number of the light-emitting units is at least two; the encapsulation bracket comprises a metal baseplate and an insulating frame; a bracket electrode for fixing crystal and bonding a wire is arranged at a region, where each light-emitting unit is located, by the metal baseplate; each light-emitting unit comprises an RGB-LED chip fixed on the metal baseplate and a bond and a wire for connecting the RGB-LED chip and a bracket electrode; a protective layer is arranged on each light-emitting unit; the bracket electrode is connected with an external circuit through a bonding pad arranged on the back of the metal baseplate. The encapsulation module is in direct contact with a PCB through the metal baseplate, so that chip heat can be quickly led out; a bowl-cup structure is formed on the front, so that a light-emitting surface is unique; the multiple light-emitting units are integrated on the one encapsulation module, so that the production efficiency is further improved.

Description

technical field [0001] The invention relates to SMD LED (Surface Mounted Devices, surface mount device) packaging technology, in particular to QFN (Quad Flat No-leadPackage, square flat no-lead package) surface mount RGB LED packaging module and its manufacturing method . Background technique [0002] With the continuous development of the display industry, LEDs for display screens have changed from the original DIP (dual inline-pinpackage) structure to the SMD structure at a high speed. The advantages of installation, large luminous angle, uniform color, and reduced attenuation are more and more accepted by people. Although general SMD LEDs have the above advantages, they still have large attenuation, long heat conduction paths, low carrying current, complex production, and low reliability. Low moisture resistance and poor weather resistance; if the reliability of the product is to be improved without changing the overall structure of the product, there is still no good so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/62G09F9/33
CPCH01L25/0753H01L33/62G09F9/33H01L2933/0066H01L33/486H01L2224/48247H01L2224/32245H01L2224/73265H01L2224/97H01L2224/92247H01L33/56H01L2933/0033H01L2933/0091H01L2924/00012H01L2224/83H01L2224/85H01L2924/00H01L25/50H01L33/44H01L2933/0016H01L2933/0025
Inventor 李邵立孔一平袁信成
Owner SHANDONG JIERUNHONG OPTOELECTRONICS CO LTD
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