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Electronic device housing and preparation method for the same

A technology for electronic equipment and shells, applied in the field of electronic equipment shells and their preparation, can solve the problems of inability to transfer and absorb heat, poor temperature consistency, low heat dissipation efficiency, etc., achieve high latent heat, good consistency, and easy to carry Effect

Inactive Publication Date: 2017-09-15
HEBEI INSTITUTE OF ARCHITECTURE AND CIVIL ENGINEERING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the currently studied phase change materials for electronic products still generally have the following defects: (1) leakage and volume expansion problems, low heat dissipation efficiency, and poor temperature consistency; (2) low thermal conductivity, generally at 1.0W / Below mK, the heat cannot be efficiently transferred and absorbed; (3) poor thermal stability and short phase change life

Method used

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  • Electronic device housing and preparation method for the same
  • Electronic device housing and preparation method for the same
  • Electronic device housing and preparation method for the same

Examples

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preparation example Construction

[0100] In the second aspect, this implementation mode also provides a method for manufacturing the casing of the above-mentioned electronic device, the method includes the following steps:

[0101] (a) Weigh capric acid and lauric acid respectively, mix and heat, and stir continuously during the heating process until all capric acid and lauric acid are heated to a molten state to obtain the capric acid-lauric acid binary composite phase variable material;

[0102] (b) Place the shell body in a water bath at 38°C to 45°C, inject the capric acid-lauric acid binary composite phase change material into the hollow cavity, and after the injection is completed, put the shell body take out;

[0103] (c) Paste the heat conduction sheet on the inner layer of the housing body, and then attach the heat dissipation sheet to the heat conduction sheet.

[0104] The method for preparing the casing of an electronic device provided in this embodiment is to firstly heat capric acid and lauric ...

Embodiment 1

[0114] Such as figure 1 - Figure 6 As shown, this embodiment provides a casing of an electronic device, including a casing body 1, and the casing body 1 sequentially includes a heat sink 101, a heat conduction sheet 102, an inner layer 103 of the casing body, and a hollow cavity 104 from the inside to the outside. and the shell body outer layer 105; the hollow cavity 104 is filled with a phase change material 106, and the phase change material 106 includes capric acid-lauric acid binary composite phase change material.

[0115] The electronic device in this embodiment is a mobile phone.

[0116] Such as figure 2 As shown, the housing body 1 also includes a side wall 107 extending inward from the periphery of the outer layer 105 of the housing body. The outer layers 105 of the housing body are connected smoothly, and the other end is an arc that gradually converges toward the accommodation space. The housing body 1 is provided with a camera reserved hole 108 .

[0117] I...

Embodiment 2

[0126] Different from Example 1, in this example, the weight ratio of capric acid and lauric acid is 1:5, and the volume of the phase change material accounts for 90% of the volume of the hollow cavity.

[0127] The heat sink is a graphite heat sink; the heat conduction sheet is a heat conduction silica gel sheet; the inner layer of the shell body and the outer layer of the shell body are made of copper. Among them, the thermally conductive silica gel sheet is mainly prepared from the following raw materials in parts by weight: 90 parts of magnesium oxide, 2.5 parts of methyl vinyl silicone rubber, 6.5 parts of vinyl silica gel, 9 parts of dimethyl silicone oil, 1-ethynyl-1- 0.25 parts of cyclohexanol and 0.3 parts of platinum catalyst.

[0128] The thickness of the phase change material is 1.0mm, the thickness of the graphite heat sink is 0.1mm, the thickness of the thermal silica gel sheet is 0.2mm, the thickness of the inner layer of the shell body and the outer layer of the ...

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Abstract

The invention belongs to electronic device technology field and particularly relates to an electronic device housing and a preparation method for the same. The electronic device housing of the invention comprises a housing main body; the housing main body comprises a heat radiation sheet, a heat conducting sheet, a housing main body inner layer, a vacuum chamber and a housing main body outer layer which are arranged from the inside to the outside; the vacuum chamber is filled with a phase transition material; the phase transition material comprises a capric acid-lauric acid binary complex phase transition material; the housing of the electronic device has excellent performances of heat conducting and heat radiation, which does not affect normal working of the electronic device; the electronic device housing is small in volume, easy to carry, low in manufacture cost and safe in usage, can be widely applied to the mobile phone, the flat computer, the personal digital assistant, etc, and achieves a goal of controlling temperature and protecting the electronic device.

Description

technical field [0001] The invention belongs to the technical field of electronic equipment, and relates to heat dissipation of electronic equipment, in particular to a shell of electronic equipment and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, electronic devices such as mobile phones and tablet computers have been popularized in people's study and life and become necessities of life. The functions of electronic products are becoming more and more perfect, and the degree of integration of the corresponding circuits is also getting higher and higher. Electronic components will inevitably generate heat during use. If the heat cannot be dissipated in time, the temperature of electronic components will rise. Miniaturization, multi-function and integration have made the "thermal barrier" problem of electronic products increasingly prominent. Taking smart phones as an example, people have higher and higher re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20B29C45/14B29C69/00C08L83/04C08L83/07C08K3/22C08K5/05
CPCH05K7/20409B29C45/14B29C69/00B29L2031/3406C08K2003/222C08L83/04C08L2205/025C08L2205/035H05K7/20481C08K3/22C08K5/05
Inventor 贾玉贵赵昕波孔婵师涌江李国明
Owner HEBEI INSTITUTE OF ARCHITECTURE AND CIVIL ENGINEERING
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