Surface mounting type RGB-LED (Red, Green and Blue-Light Emitting Diode) packaging module integrating IC (Integrated Circuit)

A RGB-LED, mount-type technology, applied in the field of integrated IC surface-mount RGB-LED packaging modules, can solve the problems of complicated PCB circuit design and low production efficiency of single mount, and achieve improved resistance The effect of external mechanical strength, simplified circuit design, and low maintenance cost

Active Publication Date: 2017-06-13
SHANDONG JIERUNHONG OPTOELECTRONICS CO LTD
View PDF7 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a surface-mounted RGB LED packaging module with integrated IC, which aims to solve the problems of low production efficiency of the existing RGB LED single mounting and complicated PCB board circuit design for subsequent mounting.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface mounting type RGB-LED (Red, Green and Blue-Light Emitting Diode) packaging module integrating IC (Integrated Circuit)
  • Surface mounting type RGB-LED (Red, Green and Blue-Light Emitting Diode) packaging module integrating IC (Integrated Circuit)
  • Surface mounting type RGB-LED (Red, Green and Blue-Light Emitting Diode) packaging module integrating IC (Integrated Circuit)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0026] see Figure 3 to Figure 5 , a surface-mounted RGB LED package module with integrated IC provided by the present invention, including a package bracket and a light-emitting unit arranged on the package bracket, the number of the light-emitting units is at least two, and the package The IC driver module 500 is integrated on the bracket, and the light-emitting unit is electrically connected to the IC driver module 500, while the traditional IC driver module is placed on the PCB board, the number of lamp beads to be controlled is large, and the circuit design of the PCB board is complicated. The light-emitting unit on the package module is controlled by the IC driving module 500, which greatly simplifies the circuit design of the PCB ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a surface mounting type RGB-LED (Red, Green and Blue-Light Emitting Diode) packaging module integrating an IC (Integrated Circuit). The surface mounting type RGB-LED packaging module comprises a packaging bracket, and light emitting units arranged on the packaging bracket; at least two light emitting units are arranged; the packaging bracket is integrated with an IC driving module; the light emitting units are electrically connected with the IC driving module. According to the surface mounting type RGB-LED packaging module integrating the IC, provided by the invention, the plurality of light emitting units are integrated on one packaging module, so that the production efficiency is improved and the production cost is reduced. Furthermore, the plurality of light emitting units are integrated on one packaging module and the whole outside mechanical strength resisting capability of a display screen can be effectively improved. Meanwhile, the packaging module is integrated with the IC and the plurality of light emitting units on the module are controlled, so that a subsequent circuit design of a PCB (Printed Circuit Board) is simplified and a production process is simplified.

Description

technical field [0001] The invention relates to SMD LED (Surface Mounted Devices, surface mount device) packaging technology, in particular to a surface mount RGB LED packaging module with integrated IC. Background technique [0002] The existing small-pitch LED displays mainly use 2121, 1515, 1010, 0808 and other types of packaging devices. With the shrinking of the pixel pitch of the LED display, the number of packaged devices per unit area is increasing, making the proportion of packaged devices in the cost of the entire screen on the rise. According to estimates, the cost of packaging devices has accounted for more than 70% of the small-pitch LED display P1.9 and smaller-pitch models. As long as the density is increased by one level, the demand for lamp beads will increase by about 50%, which means that the production capacity of all lamp bead manufacturers needs to increase by more than 50%. At present, the full-color lamp beads used in small spacing are mainly in the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16G09F9/33
CPCH01L25/167G09F9/33
Inventor 李邵立孔一平杨学良袁信成
Owner SHANDONG JIERUNHONG OPTOELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap