A kind of bga molding die

Abstract

The invention discloses a BGA (ball grid array) molding mold for semiconductor packaging and a working method of the BGA molding mold. The BGA molding mold comprises a mold base. A plurality of charging barrels are distributed in the middle of the mold base vertically and evenly. Mold boxes are arranged on the left sides and the right sides of the charging barrels. Each mold box comprises a plurality of cavities. The cavities are separated from one another through cavity forming strip modules. Each cavity forming strip module comprises two adjacent forming strips. Vertical position adjusters and horizontal position adjusters are mounted in outer frame strips of the cavities. Each vertical position adjuster comprises a left adjusting unit and a right adjusting unit which are in symmetricaldistribution. The left adjusting units and the right adjusting units comprise moving members and fixed members. The moving members are fixedly connected with the ends of the forming strips. The vertical position adjusters comprise the left adjusting units and the right adjusting units, the positions of the two corresponding forming strips can be adjusted individually, and accordingly, requirementon tiny size change of a base plate in each mold box cavity is met.

Description

Technical field: [0001] The invention relates to the technical field of semiconductor packaging, in particular to a BGA molding die. Background technique: [0002] In the MOLDING process of semiconductor packaging, due to the particularity of the substrate material, the control accuracy of some of the substrates of different manufacturers and types cannot meet the packaging requirements. The substrate is actually a PCB board, and many dimensions can only be about ±0.1mm. In the MOLDING process, because the smallest particle of the material epoxy resin is smaller than this size, there is a problem of overflow of the molding compound, and the equipment cannot work automatically. [0003] The current measures are to compensate and control the size of different batches of substrates by replacing the eccentric positioning pins, so as to ensure that the gap is smaller than the smallest particle of epoxy resin, and the equipment can work automatically. The prior art adopts the po...

AI Technical Summary

Problems solved by technology

The prior art adopts the positioning method of eccentric pins (specifically refer to the technical document of a BGA molding mold whose application publication number is CN104552672A), although in the positioning of the BGA molding mold, the needle tip width of the existing eccentric positioning pins can be based on The installation pin hole of the positioning pin is changed and processed, but the existing problem is that every time the positioning pin is replaced, the mold needs to be disassembled and reassembled, which is time-consuming and there are other problems caused by incorrect assembly, etc. In addition, the processing requirements of the eccentric positioning pin are high. ,high cost

[0005] In the prior art, the cavity strips are designed to be micro-adjustable to meet the packaging of various BGAs with slight changes in size, but there are certain problems in the above technical solutions: when the cavity strips are adjusted, it will inevitably lead to two adjacent molds. If one size of the cavity becomes larger and the other becomes smaller, then this will definitely not be able to meet all BGA package sizes.

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