Method for characterizing printed circuit board insulation life in salt spray environment
A printed circuit board, insulation life technology, applied in the field of electrified railway, to achieve the effect of ensuring safety
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Embodiment 1
[0052] figure 1 It is a schematic flowchart of the method for characterizing the insulation life of a printed circuit board in a salt spray environment provided by Embodiment 1 of the present invention. Such as figure 1 As shown, the method includes the following steps:
[0053] S11. Test the insulation characteristic parameter y of the printed circuit board under different accelerated salt spray aging times t:
[0054] In the embodiment of the present invention, the insulation characterization parameters used can be any or any number of insulation characterization parameters commonly used in the field. However, in order to more accurately characterize the insulation life of the printed circuit board in the salt spray environment, in the present invention In this example, the insulation characterization parameters are preferably insulation characterization parameters that are significantly affected by the aging of the printed circuit board, such as interlayer insulation resist...
Embodiment 2
[0098] As an example, the second embodiment is described by taking two insulation characteristic parameters as an example. Further, the two insulation characterization parameters are interlayer insulation resistance and impulse withstand voltage respectively.
[0099] Figure 6 It is a schematic flowchart of a method for characterizing the insulation life of a printed circuit board in a salt spray environment provided by Embodiment 2 of the present invention. Such as Figure 6 As shown, the method includes the following steps:
[0100] S61. Test the interlayer insulation resistance of printed circuit boards under different accelerated salt spray aging times t:
[0101] The interlayer insulation resistance R of the printed circuit boards under different accelerated salt spray aging times t was tested by using the method for testing the interlayer insulation resistance described in Embodiment 1.
[0102] S62. Test the impulse withstand voltage of printed circuit boards under...
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